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Infineon Reaches Next Milestone on 200 mm SiC Roadmap

02/13/2025 | Infineon
Infineon Technologies AG has made significant progress on its 200 mm silicon carbide (SiC) roadmap. The company will already release the first products based on the advanced 200 mm SiC technology to customers in Q1 2025.

onsemi Completes Acquisition of Qorvo’s Silicon Carbide JFET Technology Portfolio

01/16/2025 | onsemi
onsemi announced that it has completed its acquisition of the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash.

BAE Systems Awarded $347M NERVE Contract From NGA to Modernize and Sustain GEOINT Library

01/13/2025 | BAE Systems
In 2024, the National Geospatial-Intelligence Agency (NGA) awarded BAE Systems a five-year indefinite-delivery, indefinite-quantity $347 million contract for NERVE, the National System for Geospatial-Intelligence (NSG) Enterprise Repository and Virtual Environment program. NERVE will modernize the NSG Consolidated Library (NCL), which includes expanding it from a physical data center to cloud-based data services.

Kickstart 2025 With Advanced PCB Design Skills

12/17/2024 | Corey Lynn, IPC
As the new year approaches, it's the perfect time to set your professional goals and enhance your expertise in the dynamic field of electronics. IPC's January and February 2025 lineup offers a variety of courses designed to meet the needs of professionals at every level of their career, from beginners to seasoned experts. Whether you're looking to delve into the intricacies of radio frequency PCB design, tackle the challenges of military and aerospace applications, or start from the basics with our introductory courses, there's something for everyone. Enroll today and take the next step toward mastering your craft in the electronics industry.

Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components

12/13/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce and Bosch have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $225 million in proposed direct funding under the CHIPS and Science Act.
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