Punching Out: M&A North American PCB and EMS Deals for the First Half of 2025
The Chemical Connection: Sales Organization from a Capital Equipment Perspective
Marcy’s Musings: From Pitch to PO—The Sales Stack
AT&S Starts Construction of First High-tech Manufacturing Facility in Southeast Asia
October 29, 2021 | AT&SEstimated reading time: 2 minutes
AT&S, one of the globally leading manufacturers of high-end printed circuit boards and IC substrates, headquartered in Austria (Europe), announced detailed project information on the company’s planned investment in a state-of-the-art factory for IC substrates at the Kulim Hi-Tech Park, Kedah.
During a press conference, AT&S CEO Andreas Gerstenmayer and AT&S COO Ingolf Schroeder gave insights into the planned investment, the project scope, technology details, as well as the planned activities to hire approx. 6,000 highly qualified employees.
AT&S’ new campus for the production of IC substrates in Kulim Hi-Tech Park, Kedah, involves a proposed total investment for phase 1 of RM 8.5 billion (€1.7 billion). The construction of the facility is going to start with an official groundbreaking ceremony on October 30, 2021, with commercial operations targeted to come on stream in 2024.
“I want to thank the Malaysian government as well as the MIDA (the government’s principal promotion agency under the Ministry of International Trade and Industry) for the great support throughout the entire process, from the start of our location scouting until today,” says AT&S CEO Andreas Gerstenmayer. “Already today, Malaysia is an important hub for the chip supply chain. We are convinced that Malaysia can further strengthen its position as a technology country and will develop its position in the region as a high-tech manufacturing hub in Asia,” Gerstenmayer says.
Not only will thousands of new jobs be created in the region, but Malaysia will make a name for itself as a hotspot for a completely new, first-of-its-kind technology segment. “AT&S brings the latest generation of high-end technologies to Malaysia and will establish a completely new technology sector in one of the future global microelectronic hotspots. In addition to manufacturing high-tech products, extensive R&D activities will also be conducted at this new site,” AT&S COO Ingolf Schroeder says.
All these activities require a high amount of highly qualified human resources and will boost the region’s labor market. The search profiles for employees at the new AT&S plant range from specialists, managers, and leaders in the areas of electronic, mechanical, and chemical engineers, and business. At the same time, AT&S is also looking for about 4,500 blue-collar workers who can work in a highly sophisticated shop floor environment.
Besides manufacturing, R&D will also be a focus at the new AT&S facility in Kulim. Therefore, AT&S is investigating cooperation and partnerships with leading universities in Malaysia. “These partnerships will not only help us to discover new paths for the microelectronics industry,” Andreas Gerstenmayer says. “They will also make an important contribution to the development of extensive know-how in the various areas of the microelectronics industry for Malaysia and, at the end of the day, contribute to the positive development of the society.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/25/2025 | Marcy LaRont, I-Connect007In industry news this past week, I’m putting a focus on sustainability in electronics by highlighting my interview with Kelly Scanlon and Corey Dehmey, and Nolan Johnson’s Meet the Author podcast with Beth Turner of MacDermid Alpha Electronics Solutions. I also chose to spotlight the M&A activity and outlook in the U.S. market and regional market news in India and Mexico.
Calumet Electronics Continues to Advance Domestic HDI Circuit Board and Organic Substrate Capability
07/25/2025 | Calumet ElectronicsCalumet Electronics Corporation, a leading American-made printed circuit board (PCB) manufacturer, today announces another major milestone in its ambitious program to bring advanced high-density interconnect (HDI) and high-density buildup (HDBU) capabilities online.
From Factory Floor to ‘The Component Store’
07/25/2025 | Marcy LaRont, I-Connect007Daniel Beauvois began his career in PCB manufacturing 15 years ago with zero industry experience—just a willingness to learn. Daniel immersed himself in every step of circuit board production, from hanging out on the factory floor to giving plant tours. Now, as founder of The Component Store, he’s an independent sales rep known for integrity, persistence, and deep technical knowledge. In this interview, Daniel reflects on his journey, the realities of being an outside rep, and what it takes to earn—and keep—a customer’s trust in an ever-evolving electronics industry.
LPKF Increases Revenue in the 1H of 2025 Despite global uncertainties
07/24/2025 | LPKFThe LPKF Group increased revenue by 7.2% to EUR 59.2 million in the first half of 2025 and achieved an almost balanced adjusted EBIT* (earnings before interest and taxes) of EUR -0.7 million.
New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI
07/24/2025 | I-Connect007The Optimize the Interconnect podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the Interconnect is gaining traction across the industry.