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Advanced Electronics Packaging Digest

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Manufacturing Readiness and Scaling Flex–Packaging Integration, Part 4

06/04/2026 | Anaya Vardya, American Standard Circuits
Parts 1–3 of this series examined the technical foundations, application landscape, and strategic imperatives surrounding the convergence of flexible PCBs and advanced semiconductor packaging. Part 4 turns to the factory floor: What must change in manufacturing processes, equipment, and quality systems to bring this convergence from prototype to production scale?

Key Considerations When Selecting an Aqueous Cleaning Agent

06/03/2026 | Adam Klett, Ph.D, KYZEN Corporation
Selecting the appropriate aqueous cleaning agent is one of the most consequential decisions in mitigating contamination risks in high-density designs. Highly dense electronic assemblies have introduced a new level of sensitivity to contamination. Reduced conductor spacing, bottom-terminated components, and elevated power densities significantly increase the risk that even minimal flux residues will lead to electrochemical migration, leakage currents, and long-term reliability failures.

GlobalFoundries Completes Acquisition of Synopsys’ Processo

06/03/2026 | GlobalFoundries
GlobalFoundries announced the completion of its previously announced acquisition of Synopsys’ ARC Processor IP Solutions business.

MacDermid Alpha Addresses Power Module Reliability Challenges at PCIM Europe 2026

06/01/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions will exhibit at PCIM Europe 2026, June 9 - 11 in Nuremberg, Germany, Booth 7-460.

Learning with Leo: The Cost of Cleaning and Protecting the Ozone Layer

06/03/2026 | Leo Lambert -- Column: Learning With Leo
I share this perspective based on my experience as a member of the United Nations Environment Programme (UNEP) Solvent, Coatings and Adhesives Technical Options Committee, which developed the report “Protecting the Ozone Layer” to inform policy decisions at the 1995 Meeting of the Parties to the Montreal Protocol in Nairobi. My involvement in this work dates back to 1976, when I joined Digital Equipment as an engineer supporting manufacturing operations, focusing on soldering and cleaning processes across global facilities.
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