Onshoring Advanced Packaging and Assembly Workshop

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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/16/2026 | Michelle Te, I-Connect007
Working from home really has its perks, especially when it comes to driving. I don’t miss the commute time, driving in the rain, or having to maneuver around everyone else going to work or coming home. Simply popping up to my desk in the morning is such a benefit. But what I do miss is being physically with my coworkers and the interactions that can happen when you’re all together. You just don’t get the synergy over a Teams call that you can get in person. Even more, being together fosters a sense of camaraderie you can’t get any other way.

The Good News in the PCB Market Outlook

10/16/2026 | Marcy LaRont, I-Connect007
There’s plenty of good news in the PCB market right now, but Dr. Hayao Nakahara cautions against taking the growth numbers entirely at face value. Higher prices for memory and scarce materials are helping drive some impressive financial results, even as order volumes tell a somewhat different story. At the same time, AI servers and advanced packaging are creating opportunities that could reshape where PCB manufacturers invest next.

From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest

10/14/2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.

U.S AEP Success Rides on Navigating Three Key Market Trends

10/16/2026 | Nolan Johnson, I-Connect007
The U.S. advanced semiconductor packaging strategy is beginning to take a more recognizable shape. Recent developments point to three interconnected trends: advanced packaging is moving closer to traditional electronics assembly, high-bandwidth memory (HBM) packaging is becoming part of U.S. industrial policy, and photonics is emerging as another important layer of heterogeneous integration. These trends could strengthen the U.S. position in the global advanced packaging economy. They also illustrate that much of the underlying supply chain remains incomplete.

I-Connect007 Releases Episode 3 of Qnity Podcast Series, Engineering What’s Next

10/09/2026 | I-Connect007
I-Connect007 is pleased to announce the release of the third episode of Engineering What’s Next, a six-part On the Line With… Qnity podcast series exploring the materials, technologies, and engineering challenges shaping the future of electronics. In this episode, “Rethinking PCB Design for AI Data Centers,” host Marcy LaRont speaks with Dr. Jin Hyun Hwang, business development specialist at Qnity, about how the extraordinary performance and power demands of artificial intelligence are changing the way engineers approach PCB design, materials, packaging, and system architecture.