Segment 9 of Koh Young Webinar Series: Koh Young Auto Programming (KAP)
November 24, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Watch & Learn!
In this engaging, 12-part micro webinar series, Koh Young topic experts Joel Scutchfield and Ivan Aduna examine 3D inspection, AI, CFX, connectivity and smart factory success.
At just over 8 minutes, the ninth episode, “AI in Action” is now available to view.
Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to...SMT Inspection, Today, Tomorrow and Beyond, presenters Scutchfield and Aduna share highly focused educational information on the use of data gathered during the inspection process.
In this segment, viewers will learn about 3D profilometry technology and how it converges with Koh Young’s proprietary AI technology to deliver true automatic programming. This geometry-based software solution reduces the programming process to minimize time to production and reduce costs.
This entire webinar series can be viewed in an hour and covers a comprehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes.
Visit “Converting Process Data Into Intelligence” and start watching, free, today!
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
The Chemical Connection: When the Industry Moves Faster Than the Standards
04/29/2026 | Don Ball -- Column: The Chemical ConnectionAs a supplier of wet processing equipment, we have rules and standards we must adhere to, including both regional and national electrical codes and safety and environmental regulations, as well as myriad other standards to make the equipment safe to use. Things are a little different when it comes to rules and standards for manufacturing PCBs, though, because technical advances and requirements change so quickly that standards can’t keep up.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Market Insights with Pluritec's Maurizio Bonati
04/23/2026 | Real Time with... APEX EXPONolan Johnson interviews Maurizio Bonati, VP of Sales at Pluritec, at APEX EXPO 2026. Bonati details Pluritec's three product divisions, covering a broad spectrum of PCB manufacturing. He discusses the current robust electronics market, driven by AI applications in Asia and technological investments in North America, while noting slower demand in Europe. The interview highlights key sectors like data centers, AI, and medical that benefit from advanced electronics.
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
04/21/2026 | Koh Young AmericaKoh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.