A*STAR, STMicroelectronics Team Up on Silicon Carbide R&D for EV Market, Industrial Applications
November 26, 2021 | GlobeNewswireEstimated reading time: 1 minute
The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the start of a Research & Development (R&D) collaboration in the field of silicon carbide (SiC) for power-electronics applications in the automotive and industrial markets. The collaboration sets a foundation for a comprehensive SiC ecosystem in Singapore and creates opportunities for other companies to engage with IME and ST in SiC research.
SiC solutions can outperform conventional silicon (Si) devices in power electronics for Electric Vehicles (EVs) and industrial applications to meet the need for power modules with smaller form factors or higher power outputs, as well as higher temperature operation. Under this research collaboration, A*STAR’s IME and STMicroelectronics aim to develop and optimize SiC integrated devices and package modules to offer significantly better performance in next-generation power electronics.
“We are pleased to collaborate with STMicroelectronics to develop breakthrough technologies that meet the needs of the growing electric vehicles market. Such efforts will continue to anchor high-value R&D activities in Singapore and bolster its reputation as an attractive regional hub for research, innovation and enterprise,” said Prof Dim-Lee Kwong, Executive Director of IME.
“This new collaboration with IME encourages the growth of a silicon carbide ecosystem in Singapore, as we ramp up our manufacturing activities there in addition to Catania (Italy). The multi-year collaborative effort helps us scale up our global R&D effort across our existing programs managed out of Catania and Norrköping (Sweden), covering the entire SiC value chain,” said Edoardo Merli, Power Transistor Macro-Division General Manager and Group Vice President of STMicroelectronics Automotive and Discrete Group. “IME’s strong knowledge and expertise in wide bandgap materials, and notably SiC, supports us in accelerating the development of new technologies and products addressing the challenges of sustainable mobility and better energy efficiency in a wide spectrum of applications.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
NOVOSENSE, UAES and Innoscience Advance Power Electronics for New Energy Vehicles
10/17/2025 | PRNewswireThe partnership focuses on developing next-generation intelligent integrated Gallium Nitride (GaN) products. Leveraging their combined expertise, the new devices will deliver more reliable GaN driving and protection features, enabling higher power density and paving the way for wider adoption in automotive systems.
Jabil Announces Board Transitions
10/17/2025 | JabilJabil Inc. announced that Executive Chairman of the Board of Directors Mark T. Mondello and Directors Kathleen A. Walters and Jamie Siminoff will not seek re-election at Jabil’s Annual Meeting of Stockholders in January 2026.
StenTech Strengthens Precision Parts Platform with AME Acquisition
10/17/2025 | StenTechStenTech, North America’s leading provider of SMT printing solutions and precision manufacturing, has announced the acquisition of Advanced Metal Etching, Inc. (AME), a recognized specialist in chemically etched and laser cut precision parts.
MKS’ Atotech, ESI to Participate in TPCA Show & IMPACT Conference 2025
10/17/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.