-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
LeeMAH Electronics Selects Juki’s G-Titan Screen Printer
December 1, 2021 | Juki Automation Systems (JAS), Inc.Estimated reading time: 1 minute

Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and subsidiary of Juki Corporation, is pleased to announce that LeeMAH Electronics purchased a new G-Titan Screen Printer with auto dispensing. The system was installed at the LeeMAH Electronics Dallas, TX facility and the sale was facilitated by Scott Fillebrown, Principal at Southwest Systems Technology.
LeeMAH Electronics offers manufacturing and test solutions to OEMs with high-mix and low-medium volume needs. The company offers customer-focused strategies with its California and Texas locations that total more than 140,000 ft2.
The new G-Titan Screen Printer is equipped for I4.0, lights-out manufacturing and quality print control. Standard features include stencil inspection, solder paste rolling measurement, stencil flattener, support block crash prevention, and automatic solder paste dispense (500g jar).
The G-Titan features SPI closed-loop communication. The smart SPI closed-loop function provides SPI detection information to the printer to auto adjust and offset printing conditions. This is currently compatible with major SPI manufacturers.
The automated solder paste dispensing reduces production costs by reducing production personnel, dispensing the paste directly from the jar. It extends the solder paste viscosity and maximizes the solder paste lifespan. Additionally, exposure to air is reduced, minimizing issues from improper storage. This also reduces human errors and the chance of mixing old and new solder pastes together.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.