The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
ASE to Divest Holdings in Subsidiaries to Wise Road Capital
December 3, 2021 | ASE Technology Holding Co., Ltd.Estimated reading time: 1 minute
ASE Technology Holding Co., Ltd. announces, that ASE and Beijing Wise Road Asset Management Co., Ltd. have entered into a Sale and Purchase Agreement by which ASE will sell shares and equity interests in GAPT Holding Limited (GAPT Holding Limited directly or indirectly holds 100% equity interests in Global Advanced Packaging Test (Hong Kong), ASE (WeiHai), Inc., Suzhou ASEN Semiconductors Co., Ltd. and ASE Advanced Semiconductor (Shanghai) Limited) and ASE (Kun Shan) Inc. to Wise Road Capital or its designated affiliate in exchange for a cash consideration in an aggregate amount of US$1.46 billion (the “Transaction”).
According to the sale and purchase agreement, ASE shall transfer the subject shares and equity interests in each target company to Wise Road Capital or its designated affiliate on the Completion Date. Wise Road Capital shall pay to ASE equivalent cash consideration in two parts: 1) US$1.08 billion plus aggregated cash balance and minus aggregated outstanding debt balance of the target companies will be paid upon the Completion Date and 2) US$380 million on the first business day six months after the Completion Date. ASE expects to recognize a tax effected gain of approximately US$630 million from the Transaction.
Through the completion of the Transaction, ASE will improve its overall competitive edge by optimizing its strategy and resource allocation in China, while further enhancing its investment in advanced technology development and expanding its leading edge capacities within Taiwan. ASE believes it can better leverage its global presence and leading-edge technology to better serve its global customer base.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Circus SE Set for High-Volume Market Entry in the Defense Sector
10/17/2025 | BUSINESS WIRECircus SE a global technology leader in AI robotics for autonomous nutrition systems and troop supply, is expanding its global production network as part of its high-volume market entry into the defense sector.
China Expands Rare Earth Export Restrictions, Tightening Grip on Global Supply Chains
10/16/2025 | I-Connect007 Editorial TeamChina sharply expanded its rare earth export restrictions on Oct. 9, adding additional elements and refining technologies to its control list while imposing stricter rules on foreign users in the defense and semiconductor industries.
SAMI Advanced Electronics Company Launches “Remal” Computer Manufacturing Project in Partnership with HP and Foxconn
10/15/2025 | SAMI-AECSAMI Advanced Electronics Company (SAMI-AEC), a wholly owned subsidiary of Saudi Arabian Military Industries (SAMI), proudly announced the launch of the “Remal” project for computer manufacturing, in strategic partnership with HP and Foxconn.
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
10/15/2025 | Steve Williams -- Column: The Right ApproachThere is no bronze bust in the lobby or portrait in the conference room of Electro-Tek's founder—my Dad, Charles “Chuck” Williams—so with the facility closing last year after 56 years, I feel it is time to tell the story. Chuck Williams founded Electro-Tek in 1968 in our basement, eventually moving into the second floor of an old 1913 building in downtown Milwaukee that is still standing (the first of three eventual facilities).
LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing
10/10/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.