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Siemens Unveils Next Generation AI-enhanced Electronic Systems Design Software

11/13/2024 | Siemens
Siemens Digital Industries Software announced today the latest advancement in its electronic systems design portfolio. The next generation release takes an integrated and multidisciplinary approach, bringing together Xpedition™ software, Hyperlynx™ software and PADS™ Professional software into a unified user experience that delivers cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design.

Renesas Unveils Industry’s First Automotive Multi-Domain SoC Built with 3-nm Process Technology

11/13/2024 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, launched the new generation of automotive fusion system-on-chips (SoCs), serving multiple automotive domains including Advanced Driver Assistance Systems (ADAS), in-vehicle infotainment (IVI), and gateway applications on a single-chip.

Gartner Forecasts India IT Spending to Reach $160 Billion in 2025

11/12/2024 | Gartner, Inc.
India IT spending is projected to total $160 billion in 2025, an increase of 11.2% from 2024, according to the latest forecast by Gartner, Inc.

Agileo Automation Launches E84 PIO Box at SEMICON Europa

11/12/2024 | Agileo Automation
Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor equipment manufacturers, today launches the E84 PIO Box at Booth #C2848.

DARPA Taps RTX to Strengthen Cyber Resiliency

11/11/2024 | RTX
RTX's BBN Technologies was awarded a contract to support DARPA's Compartmentalization and Privilege Management, or CPM, program. The CPM program aims to enhance cyber resilience by automatically subdividing software systems into smaller, secure compartments, preventing initial breaches from escalating into successful cyberattacks while maintaining system efficiency.
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