The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Siemens’ New mPower Solution Gains Certification for TSMC’s N7, N5 Technologies
December 10, 2021 | SiemensEstimated reading time: 1 minute
The significant power and performance advancements of TSMC’s N7 and N5 processes make them ideal for next-generation mobile, artificial intelligence, high-performance computing, and network connectivity designs, as well as other high-performance digital and mixed-signal applications.
“It is exciting to see a new entrant into this critical EDA field of power integrity,” said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. “This joint effort combining Siemens’ new mPower solution and TSMC’s N7 and N5 processes will enable customers to take full advantage of the power and performance improvements of TSMC’s advanced technologies to accelerate innovation for their differentiated products.”
Siemens’ mPower integrated circuit (IC) power integrity verification solution supports analog, digital, and mixed signal designs, while enabling comprehensive power, electromigration (EM) and voltage drop (IR) analysis.
“Siemens is pleased that TSMC, an industry leader in process technologies, has now certified mPower for its N7 and N5 processes,” said Michael Buehler-Garcia, vice president of Product Management for Calibre Design Solutions at Siemens Digital Industries Software. “Siemens’ collaboration with TSMC on these certifications will help our mutual customers conduct power integrity analysis tasks more quickly and accurately, enabling faster tape-outs with enhanced reliability and quality of results.”
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Target Condition: Rethinking the PCB Stackup Recipe
10/01/2025 | Kelly Dack -- Column: Target ConditionMarie Antoinette is attributed with saying, “Let them eat cake,” but historians now agree she likely never said it. It was probably revolutionary propaganda to paint her as out of touch with the starving masses. Yet, the phrase still lingers, and oddly enough, it applies to the world of PCB design.
Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
09/25/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.