Picosun to Introduce Novel Coating Solution for Organic Electronics
December 14, 2021 | PRNewswireEstimated reading time: 1 minute

There has been a need for enhanced coating methods in organic electronic manufacturing as foldable phones and other future product iterations need materials that are lighter, more reliable and enable folding and stretching of a device. Thus, the use of thin film encapsulation solutions has become more common in organic electronic manufacturing.
Atomic layer deposition (ALD) has already proven to be the coating solution of choice for a wide range of applications in the semiconductor industry. Inorganic films, which are the standard output of an ALD process, are however susceptible to crack or develop defects under severe mechanical stress. This issue is magnified when depositing on large surface areas often required in flexible organic electronics manufacturing. Picosun's novel approach to address these issues, for which patent rights are pending, includes nanolamination of dense inorganic layers deposited with ALD to maintain excellent barrier performance‚ with organic or hybrid molecular layer deposition (MLD) layers to offer enhanced flexibility and de-emphasize the defects which may appear when films are stressed.
Picosun research on an industrially viable ALD/MLD process was demonstrated on wafers and polymer substrates over 200 mm in diameter with a deposition temperature of 90 °C using Picosun ALD tools. The results showed great thickness uniformity and higher throughput compared to pure ALD film deposition. The MLD film proved to be stable in ambient environment and the complementary strengths of ALD and MLD hindered H2O permeation through the film stack, which enables flexibility in moisture barrier design.
"We are excited to bring these insights to the market as there has been little information available from stable and industrially viable MLD processes in full wafer scale. Besides organic electronics, we see immense potential with the ALD/MLD films in the manufacturing of LEDs, MEMS and medical packaging", states Juhana Kostamo, VP, Industrial Business Area of Picosun Group.
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Nortech Positioned to Serve Global Markets Amid Tariff Challenges
04/18/2025 | BUSINESS WIRENortech Systems, a global leader in digital connectivity solutions and data management engineering, is strategically positioned to serve customers in Europe and the Asia Pacific region while effectively mitigating the impact of global tariffs and trade challenges.
Can the Electronics Industry Balance Tariffs With Investment?
04/18/2025 | I-Connect007 Editorial TeamTo better understand the U.S. administration’s recent actions on global trade policies, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.
University of Arizona Pioneering Technical Education Beyond Semiconductors
04/18/2025 | Marcy LaRont, PCB007 MagazineWhile many universities struggle to keep their curriculum up to date with the evolving needs of the electronics industry, the University of Arizona stands head and shoulders above the others. Its Center for Semiconductor Manufacturing incorporates five of the colleges at UA and emphasizes an interdisciplinary approach to prepare students for diverse careers in technology and manufacturing.
IPC President’s Award: Xaver Feiner
04/17/2025 | Nolan Johnson, SMT007 MagazineThroughout his career, Xaver Feiner, vice president of marketing and sales at Zollner Elektronik, has developed extensive expertise in account management and new business development with a strong focus on the semiconductor industry, aerospace, and industrial electronics. Xaver has cultivated a profound understanding of global markets and remains deeply engaged with the challenges and opportunities presented by digital transformation. Since 2020, he has been an active member of the IPC Europe Advocacy Group, where he is dedicated to advancing the position of the electronics industry and the EMS sector across Europe.