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Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies

04/18/2025 | Real Time with...IPC APEX EXPO
Will Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.

The Test Connection, Inc. (TTCI) to Discuss Electronic Test & Manufacturing at the SMTA Capital Expo

04/15/2025 | The Test Connection Inc.
The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce its participation in the SMTA Capital Expo & Tech Forum on May 8, 2025, at the Waterford Springfield in Arlington, Virginia.

GEN3 Opens State-of-the-Art Technical Centre for Customers and Industry Professionals

04/14/2025 | Gen3
GEN3 is proud to announce the opening of the A.W Technical Centre. Named in honor of Arthur William Naisbitt—affectionately known as AW—the founder of Concoat (now GEN3) in 1969, the company has since spanned three generations. Today, AW's legacy continues with his son, Graham, and now Grandson, Andrew, at the helm of GEN3.

Keysight Introduces Next-Generation Embedded Security Testbench

04/11/2025 | BUSINESS WIRE
Keysight Technologies, Inc. announces the launch of the Next-Generation Embedded Security Testbench, a consolidated and scalable test solution designed to address the increasing complex security testing demands of modern chips and embedded devices.

Real Time with... IPC APEX EXPO 2025: SPEA—Optimizing Testing Processes in PCBA

04/10/2025 | Real Time with...IPC APEX EXPO
Mike Sexton and Dustin Warren of SPEA explore market dynamics for PCBA manufacturers. They emphasize the need for optimizing testing processes, introducing deep In-Circuit Test (ICT) technology that identifies weak components often overlooked by traditional tests. The discussion also covers flying probe technology, highlighting its flexibility for high-mix, low-volume production and comparing it with ICT testing methods.
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