Ericsson, Telstra, Qualcomm Set Uplink Speed Record of Nearly 1Gbps
December 20, 2021 | Qualcomm Technologies, Inc.Estimated reading time: 3 minutes
Ericsson, Telstra, and Qualcomm Technologies, Inc. have achieved the highest uplink peak rate ever recorded on a commercial network during a live demo in Queensland, Australia. Together, they reached an uplink data speed of close to 1Gbps, paving the way for more seamless experiences in use cases such as live video streaming and social media content sharing.
Using Ericsson’s New Radio-Dual Connectivity (NR-DC) and carrier aggregation software features together with a smartphone form-factor test device powered by Snapdragon X65 5G Modem-RF System on Telstra’s network, this new uplink speed record marks another significant milestone for the ecosystem collaboration between the three companies.
The high uplink peak rate was reached by combining the data rates from both mid-band and high band (millimeter wave) to fully utilize Telstra’s spectrum for improved user experience. The demo used Ericsson’s NR-DC software feature with uplink four-component carrier aggregation (UL 4CC CA), in which four contiguous carriers of 100MHz are combined, resulting in higher data speeds.
Delivering uplink peak rates of close to 1Gbps will enable Telstra to more than double the current uplink throughput in its 5G network. This is particularly important for supporting applications and services that involve uploading vast amounts of data.
Sibel Tombaz, Head of Product Line 5G RAN, Ericsson, says, “We continue to pursue new and innovative ways of enhancing the end-user impact of 5G. An uplink speed of close to 1Gbps using NR-DC and four-component carrier aggregation is the latest in a series of 5G milestones we have achieved in collaboration with Telstra and Qualcomm Technologies. This means users can enjoy vastly improved experiences from applications where quicker upload time makes a difference.”
Nikos Katinakis, Group Executive Networks and IT, Telstra, says, “We have a history of world firsts with Ericsson and Qualcomm Technologies. In 2016 we broke the 1Gbps barrier on 4G; in January this year, we set a new download record on 5G, and now we have set a new record in the uplink on a commercial 5G network. It is a testament to the continuous efforts of our team to innovate, and I take pride in how, together, we continue to push the boundaries of what this technology can deliver.”
Sunil Patil, Vice President, 5G Product Management, Qualcomm Technologies, explains, “Qualcomm Technologies is pleased to collaborate with Ericsson and Telstra on this 5G dual connectivity and carrier aggregation milestone. By achieving the highest uplink peak rate ever recorded on a commercial network in Queensland, Australia, we’re underscoring our commitment to enabling differentiated 5G experiences across a variety of use cases beyond mobile. Together, we are realizing the full potential of 5G through new breakthroughs that will drive transformative benefits for consumers and enterprises alike.”
Technical Info
Ericsson, Telstra and Qualcomm Technologies achieved the first on a commercial network in Queensland, Australia with a theoretical maximum uplink speed of 986 Mbps, integrating four component 100MHz carriers of millimeter wave, combining with the 100MHz of 3.6GHz spectrum. NR-DC was implemented with n78 and n258.
The testing was conducted at Telstra’s 5G Innovation Centre (5GIC) using Telstra’s commercial network resulting in a throughput of roughly 1Gbps, more than doubling the current uplink speed on the market. The smartphone form-factor test device powered by Snapdragon X65 was used with Ericsson Radio System’s Baseband 6648 and AIR 6488 for mid-band, which has been widely deployed in Telstra’s network, and Baseband 6648 with the AIR 5322 for high-band.
Ericsson’s NR-DC software combines 5G frequency ranges below 7.125 GHz (mid-band, Time Division Duplex, TDD) and above 24.25 GHz (high-band TDD) and is now available for commercial deployment. The UL 4CC carrier aggregation software is slated to go commercial globally in the second quarter of 2022.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
The Power Integrity Issue: Design007 Magazine October 2025
10/08/2025 | I-Connect007 Editorial TeamAs technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
AT&S Plans Entry Into the Defense Sector
10/02/2025 | AT&SIn times of global uncertainty and geopolitical tension, AT&S is expanding its portfolio to include the defense sector. As a globally leading provider of high-end IC substrates and printed circuit boards, the company is responding to growing demand for security-relevant solutions and emphasizing its social responsibility. This demand will be addressed from its site in Leoben, Austria.