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Intel, GoodMaps Work on Safe Indoor Navigation
December 28, 2021 | IntelEstimated reading time: Less than a minute
?As part of the Intel RISE Technology Initiative (IRTI), Intel is collaborating with GoodMaps to deliver a high-quality indoor wayfinding solution for people who are blind or visually impaired. Safely and effectively navigating indoor spaces results in greater independence and confidence when traveling. In this video, students at Portland State University share their experiences with the technology and how it has changed their lives for the better.
Intel continues to investigate volumetric mapping algorithms and advances in artificial intelligence to improve the precision and accuracy of GoodMaps’ commercial indoor wayfinding service. The IRTI reviews and funds projects related to health care, education and the economy with new, dedicated workstreams for social equity and human rights, accessibility and climate action.
Suggested Items
Incap Helps Develop Future Talent in Robotics and Engineering in Finland
05/21/2025 | IncapIncap Corporation continues to invest in the next generation of technology professionals in Finland through its involvement in two national initiatives focused on technical and vocational education.
Jabil, AVL Collaborate on Design and Manufacturing Solutions for Automotive and Transportation Customers
05/21/2025 | BUSINESS WIREJabil Inc., a global manufacturing solutions provider to market-leading automakers, announced it has signed a memorandum of understanding (MOU) with AVL Software and Functions GmbH, the e-drive and software center of AVL List GmbH.
Altus, Danutek Expand Partnership with LPKF to Offer Laser Plastic Welding Solutions
05/21/2025 | Altus GroupAltus Group, a leading supplier of capital equipment and service support for the electronics manufacturing sector in the UK and Ireland, and its sister company Danutek, which serves Central and Eastern Europe, are expanding their technology offering through an enhanced partnership with LPKF, a specialist in laser-based manufacturing solutions.
Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
05/20/2025 | Deca TechnologiesDeca Technologies announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec.
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
05/20/2025 | Jerome Larez -- Column: Global PCB ConnectionsIn the past decade, flex and rigid-flex PCB technology has become the fastest-growing market segment. As an increasing number of PCB companies develop the capabilities to fabricate this technology, PCB designers are becoming comfortable incorporating these designs into their products.