SigmaTron, Wagz Announce Closing Merger Agreement
January 4, 2022 | GlobeNewswireEstimated reading time: 1 minute

SigmaTron International, Inc., an electronic manufacturing services company and Wagz, Inc., a privately-held pet technology company, announced that the pending merger agreement, has closed on December 31, 2021. As previously announced in our press release dated December 10, 2021, the objective was to close the transaction by the end of calendar 2021. Under the final Agreement, the current shareholders of Wagz, excluding SigmaTron, will receive a total of 1,546,592 newly issued shares of SigmaTron common stock.Wagz will become a wholly-owned subsidiary of SigmaTron.Gary R. Fairhead will become the Chairman of the Board of Wagz and Terry B. Anderton will remain the Chief Executive Officer and President of Wagz.
Commenting on the closing of the transaction, Gary R. Fairhead, SigmaTron’s Chairman of the Board and Chief Executive Officer, said, “We are pleased that we were able to close the transaction with Wagz as it had been pending for an extended period of time.We believe that the Pet Tech market remains as strong as it has ever been, with Pet Tech forecasted to grow significantly as a component of the overall pet marketplace. We believe that Wagz brings unique intellectual property and experience to this expanding marketplace and their product roadmap holds significant promise.As an Internet of Things (IoT) company with the potential for recurring revenue, we are excited to join with Wagz to execute their technology vision.”
Terry B. Anderton, Wagz co-founder and Chief Executive Officer, said, “We believe that the capabilities SigmaTron and Wagz have together will provide a competitive advantage in Pet Tech as we execute the Wagz vision together. With both companies under one structure, we will be able to utilize synergy in the areas of design, manufacturing and distribution, allowing the combined entity to better utilize Wagz intellectual property and provide greater margins overall. The possibilities that this combination creates are very exciting.”
Anderton continued, “Please note that Wagz will have a booth at the CES Show in Las Vegas this week and we invite everyone to stop by and meet the Wagz team.”
Suggested Items
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
TTM Technologies Prepares For the Future with the Acquisition of a Facility in Wisconsin and Land in Penang
07/10/2025 | Globe NewswireTTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, quick-turn and technologically advanced printed circuit boards (PCB), announced the acquisition of a 750,000-square-foot facility in Eau Claire, Wisconsin, as well as land rights for an additional future manufacturing site in Penang, Malaysia.
New Podcast Series Launches: Optimize the Interconnect
07/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.