-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Indium Introduces Indalloy 291 Supplemental Bar Alloys
January 6, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation announces that it is now offering supplemental bar alloys for Indalloy 291 wave solder pots designed to maintain recommended solder pot specifications.
The supplemental bar and bar chips are added to Indalloy®291-containing solder pots that have fallen below or have elevated above the recommended specifications. This can be determined by solder analysis performed by Indium Corporation.
During wave soldering, when the molten solder contacts the air and manufacturing environment, a chunky layer of metal collects on the smooth surface of the molten solder—solder dross. Indium Corporation’s Dross Reduction Bar aids in the reduction of this solder dross build-up within Indalloy®291 solder pots. By reducing dross formation, the Dross Reduction Bar also reduces the amount of solderable metal lost in the solder pot, providing the user a considerable cost-savings over time.
If instead during wave soldering the molten solder contacts a copper-containing PCB, such as an OSP board, the copper from the board can be pulled into the solder wave, increasing
the solder pot’s copper content to an undesirable level. As copper levels gradually rise to become out-of-spec within an Indalloy®291 solder pot, adverse effects to wetting performance and solder joint aesthetics can become more perceptible. Indium Corporation’s Replenisher Bar is used to bring the copper levels back within the recommended solder pot specifications.
Indium Corporation also offers a solder and solder dross recycle program to complete the usage cycle for bar solder. Up to 50% of bar solder used in wave soldering will be converted to dross, which still contains mostly usable metal. Indium Corporation can recycle these materials and return the metal value to you as a credit, or convert them to a usable bar for a fee. During an alloy switchover, use Indium Corporation’s recycling service to reclaim value on the pot dump and leftover bar.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.