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Indium Introduces Indalloy 291 Supplemental Bar Alloys
January 6, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation announces that it is now offering supplemental bar alloys for Indalloy 291 wave solder pots designed to maintain recommended solder pot specifications.
The supplemental bar and bar chips are added to Indalloy®291-containing solder pots that have fallen below or have elevated above the recommended specifications. This can be determined by solder analysis performed by Indium Corporation.
During wave soldering, when the molten solder contacts the air and manufacturing environment, a chunky layer of metal collects on the smooth surface of the molten solder—solder dross. Indium Corporation’s Dross Reduction Bar aids in the reduction of this solder dross build-up within Indalloy®291 solder pots. By reducing dross formation, the Dross Reduction Bar also reduces the amount of solderable metal lost in the solder pot, providing the user a considerable cost-savings over time.
If instead during wave soldering the molten solder contacts a copper-containing PCB, such as an OSP board, the copper from the board can be pulled into the solder wave, increasing
the solder pot’s copper content to an undesirable level. As copper levels gradually rise to become out-of-spec within an Indalloy®291 solder pot, adverse effects to wetting performance and solder joint aesthetics can become more perceptible. Indium Corporation’s Replenisher Bar is used to bring the copper levels back within the recommended solder pot specifications.
Indium Corporation also offers a solder and solder dross recycle program to complete the usage cycle for bar solder. Up to 50% of bar solder used in wave soldering will be converted to dross, which still contains mostly usable metal. Indium Corporation can recycle these materials and return the metal value to you as a credit, or convert them to a usable bar for a fee. During an alloy switchover, use Indium Corporation’s recycling service to reclaim value on the pot dump and leftover bar.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
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