Vodafone, Qualcomm Technologies, Thales Deliver World-First Smartphone Demonstration of iSIM Technology
January 18, 2022 | Qualcomm Technologies, Inc.Estimated reading time: 3 minutes
Leading industry innovators Vodafone, Qualcomm Technologies, Inc., and Thales have joined forces to demonstrate a working smartphone featuring iSIM (based on the ieUICC[1] GSMA specification) - a new technology enabling the functionality of a SIM card to be integrated into a device’s main processor. This milestone paves the way for commercialisation of the technology, which could be rolled out in a host of new devices that will use iSIM to connect to mobile services.
The iSIM, which complies with GSMA specifications, embeds the SIM functionality into the device’s main processor, allowing for greater system integration, higher performance, and increased memory capacity. This technology is the latest evolution of SIM technology in which ‘eSIMs’ are embedded into devices. However, eSIM requires a separate chip: with iSIM this is no longer necessary and removes the need for dedicated space assigned to SIM services.
iSIM technology is a significant evolution on existing eSIM solutions and delivers wholesale benefits to both consumers and telecommunications operators, further paving the way for mobile services to be integrated into devices beyond the mobile phone, taking the mobile experience to laptops, tablets virtual reality platforms, IoT devices, wearables, and more. The iSIM is integrated in the application processor of the device bringing multiple benefits:
- Simplifies and enhances device design and performance by releasing space previously occupied within a device
- Consolidates the SIM functionality into the device’s main chipset alongside other critical capabilities such as GPU, CPU, and modem
- Enables remote SIM provisioning by the operator leveraging the existing eSIM infrastructure
- Opens mobile service connection capabilities to a host of devices that previously could not have SIM capabilities built-in
A proof of concept (POC) demonstration took place in Europe, as one of the highest global smartphone penetration regions. The POC illustrates the technology’s commercial readiness and efficiency working on existing infrastructure, leveraging Vodafone’s advanced network capabilities. In the demonstration, the fully operational proof of concept device used on Vodafone’s network was based on the Samsung Galaxy Z Flip3 5G powered by a Snapdragon® 888 5G Mobile Platform, which features a built-in Qualcomm® Secure Processing Unit running the Thales iSIM operating system for the purpose of this demonstration. This proof of concept took place in Samsung’s R&D labs using Vodafone’s advanced remote management platform.
Alex Froment-Curtil, chief commercial officer, Vodafone, said: “Our aim is to create a world where every device connects seamlessly and simply to each other, and the customer has complete control. The iSIM, combined with our remote management platform, is a major step in this direction, allowing devices to be connected without a physical SIM or dedicated chip, making connectivity to many objects – the promise of the connected IoT world – a reality. It will enable our customers to enjoy the ease of multiple accounts on one device, while from an operator’s point of view, help eliminate the need for separate SIM cards and the additional plastic this consumes. We will continue working closely with Qualcomm Technologies and Thales to evolve further applications for this technology and accelerate its commercialisation.”
Enrico Salvatori, senior vice president and president, Europe/MEA, Qualcomm Europe, Inc., said: “iSIM solutions offer great opportunities to MNOs, free-up valuable space in devices for OEMs, and provide flexibility for device users to benefit from the full potential of 5G networks and experiences across a wide range of device categories. Some of the areas that will benefit most from iSIM technology include smartphones, mobile PCs, VR/XR headsets, and industrial IoT. By engineering the iSIM technology into the SoC, we are able to create additional support for OEMs in our Snapdragon platform.”
Emmanuel Unguran, senior vice president mobile connectivity solutions at Thales, said: “With new types of networks and devices rolling out, innovation in SIM technology is essential to best serve the connected world. The iSIM supports new device design and manufacture while providing the same digital experience as the eSIM, and certified security levels. Thales is committed to on-going innovating with our partners to provide the best connectivity experience.”
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Circus SE Set for High-Volume Market Entry in the Defense Sector
10/17/2025 | BUSINESS WIRECircus SE a global technology leader in AI robotics for autonomous nutrition systems and troop supply, is expanding its global production network as part of its high-volume market entry into the defense sector.
China Expands Rare Earth Export Restrictions, Tightening Grip on Global Supply Chains
10/16/2025 | I-Connect007 Editorial TeamChina sharply expanded its rare earth export restrictions on Oct. 9, adding additional elements and refining technologies to its control list while imposing stricter rules on foreign users in the defense and semiconductor industries.
SAMI Advanced Electronics Company Launches “Remal” Computer Manufacturing Project in Partnership with HP and Foxconn
10/15/2025 | SAMI-AECSAMI Advanced Electronics Company (SAMI-AEC), a wholly owned subsidiary of Saudi Arabian Military Industries (SAMI), proudly announced the launch of the “Remal” project for computer manufacturing, in strategic partnership with HP and Foxconn.
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
10/15/2025 | Steve Williams -- Column: The Right ApproachThere is no bronze bust in the lobby or portrait in the conference room of Electro-Tek's founder—my Dad, Charles “Chuck” Williams—so with the facility closing last year after 56 years, I feel it is time to tell the story. Chuck Williams founded Electro-Tek in 1968 in our basement, eventually moving into the second floor of an old 1913 building in downtown Milwaukee that is still standing (the first of three eventual facilities).
LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing
10/10/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.