Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
SEMI FlexTech Funds 5 New R&D Projects for Flexible Hybrid Electronics
January 19, 2022 | SEMIEstimated reading time: 1 minute
SEMI FlexTech announced more than $5 million in funding for five new research and development (R&D) projects aimed at flexible hybrid electronics (FHE) innovations for sensors, medical devices, automotive electronics and other consumer and industrial microelectronics products.
“The new projects push the limits of technology in ways that are not funded by private sector alone, illustrating the vital importance of the SEMI FlexTech program in evolving FHE technology development across multiple high-growth industries,” said Gity Samadi, Director of R&D Programs for SEMI FlexTech. “Flexible hybrid electronics help transform traditional rigid products into devices that are conforming, highly reliable, and often more sustainable.”
Project Overviews
ACI Materials will optimize the performance of its Alchemy high-film-thickness conductive sintering and semi-sintering pastes, inks, and coating for additive manufacture of higher performance FHE and direct writing in 3D printed circuit structures. Advanced inks are a key enabler to the continued growth of 3D printed components, a rapidly growing manufacturing capability. ACI is teaming with nScrypt for this 18-month project costing $510,000.
The University of Washington will demonstrate a systematic approach to in situ monitoring and machine learning control of electrohydrodynamic inkjet printing, enabling adaptable and scalable micron-scale manufacturing of 2D optics, interconnects and flexible devices. The UW will team with Iowa State University, SIJTechnology, Cyber Manufacturing and Metrology Solutions and Kent Displays on this $848,847 project.
Cornell University will apply artificial intelligence (AI) to increasing the reliability of printed electronics using optical and ultrasonic metrologies and acoustic emissions. Cornell will team with BotFactory and Geegah LLC on this $575,000 project.
GE Research will develop and demonstrate a bio-inspired soft robot for assisting a human operator in performing inspection maintenance and repair (IMR) in highly confined spaces inside industrial and defense facilities. GE Research will collaborate with Binghamton University, Georgia Tech and UES on this 18-month project costing $2 million.
GE Research will develop a high-power (?1.2kV), low-profile, low-inductance silicon carbide power module using conformable direct write interconnects and packaging. Costing $1.8 million, the 18-month project promises to make high-power, high-voltage and high-current electronics more customizable and reduce the cost of producing them in low volume.
The FlexTech R&D program is supported by the U.S. Army Research Laboratory (ARL), based in Adelphi, Maryland.
Share on:
Suggested Items
STI Electronics Celebrates Frank Honyotski’s 25 Years of Service
06/02/2025 | STI ElectronicsSTI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract PCB manufacturing, proudly announces the 25th work anniversary of Frank Honyotski, Master Instructor.
Axxon-Mycronic Showcases Precision Protection Technologies for Extreme Environments at Space Tech Expo
06/02/2025 | Axxon-MycronicAxxon-Mycronic, a leading, global supplier of innovative and production-ready, dispensing and conformal coating systems, is pleased to announce its participation at the Space Tech Expo USA 2025, taking place June 3-4, 2025 at the Long Beach Convention Center in Long Beach, California. Axxon-Mycronic will be exhibiting in Booth #552.
Living His Dream: IPC EAO Course Leads Thejas K to Role as Quality Engineer
05/30/2025 | Michelle Te, IPC CommunityIt’s not often that a child wants to follow in the footsteps of their parents’ career. But Thejas K, a 22-year-old from Mysuru, India, whose mother Padmavathi was an EMS operator for nearly 20 years, is now an associate engineer in the quality department at Cyient DLM where PCB assemblies are manufactured for aerospace and defense.
GTSMT SMT Production Lines are Transforming Modern Electronics Manufacturing
05/29/2025 | EINPresswire.comGTSMT, a prominent leader in the Surface-Mount Technology (SMT) sector, announced the introduction of cutting-edge innovations designed to tackle the evolving challenges facing the global electronics manufacturing industry.
IPC Applauds Leadership of Reps. Moore and Krishnamoorthi on PCB Manufacturing Bill
05/28/2025 | IPCIPC, the global electronics association serving more than 1,400 U.S. companies and over 3,200 worldwide, strongly supports the bipartisan reintroduction on May 28 of the Protecting Circuit Boards and Substrates (PCBS) Act in the 119th Congress.