Pearl Semi Selects Siemens‘ Symphony AMS Platform for its Novel Low-noise Digital PLL Design
January 27, 2022 | SiemensEstimated reading time: 2 minutes
Siemens Digital Industries Software has announced that Pearl Semiconductor, a fabless semiconductor company specializing in high-performance timing products, used Siemens‘ Symphony Mixed-Signal Platform for developing and verifying its newest ultra-low noise digital phased locked loop (PLL) design, which targets a range of demanding applications such as high-speed connectivity, high bandwidth video broadcasting and 5G infrastructure markets.
Leveraging the fast simulation performance of Siemens‘ Symphony Mixed-Signal Platform, Pearl Semiconductor rapidly achieved silicon-accurate simulation for its latest PLL offering, while boosting functional verification cycles by 4x. This dramatic acceleration helped Pearl achieve aggressive time-to-market objectives.
“With the exponential rise of data due to digitization, the need for a worldwide upgrade of bandwidth and data network infrastructure is happening at a rapid pace,“ said Mohamed Dessouky, vice president of engineering for Pearl Semiconductor. “High-performance timing solutions like our latest PLL offering play a key role in increasing bandwidth for network ICs. Our novel PLL architecture continuously suppresses spurs, while minimizing the noise contribution of active circuitry within the PLL bandwidth. Designing these complex circuits requires a robust mixed-signal verification solution, and this is why we selected Siemens’s Symphony Mixed-Signal Platform for extensive mixed-signal verification of our PLL designs The flexibility of Symphony to work with our mixed-signal use cases and the tool’s ease-of-use resulted in wider adoption across our verification teams and resulted in 4X productivity improvement.”
Powered by Siemens’ Analog FastSPICE (AFS) technology, the Symphony Mixed-Signal Platform combines the leading foundry-certified circuit simulator with industry-standard hardware description language (HDL) simulators to provide fast and accurate verification of complex nanometer-scale mixed-signal integrated circuits (ICs). The platform’s modular architecture leverages Siemens‘ AFS circuit simulator software to provide exceptionally fast mixed-signal simulation performance with nanometer-scale SPICE accuracy and compatibility with all leading digital solvers, including Siemens‘ Questa™ functional verification tool family.
"The need for ultra low-noise high bandwidth timing solutions is becoming critical in many applications, and mixed-signal innovations such as Pearl's DSP+analog-based solutions are critical to meet those requirements," said Ravi Subramanian, senior vice president and general manager for the IC Verification Solutions Division at Siemens Digital Industries Software."We are pleased that our Analog FastSPICE and Symphony Mixed Signal Platforms played a key role in Pearl’s development of their latest ultra-low noise digital PLL design.“
Check out this additional content from Siemens Digital Industries Software:
- The Printed Circuit Assembler's Guide to ...Smart Data: Using Data to Improve Manufacturing by Sagi Reuven and Zac Elliott (a free eBook available for download)
- The Printed Circuit Assembler's Guide to… Advanced Manufacturing in the Digital Age by Oren Manor (a free eBook available for download)
- The Printed Circuit Designer’s Guide to… Power Integrity by Example by Fadi Deek (a free eBook available for download)
- Siemens’ free, 12-part, on-demand webinar series?“Implementing Digital Twin Best Practices From Design Through Manufacturing.”
- RealTime With ...?Siemens and Computrol: Achieving Operational Excellence in Electronics Manufacturing
- You can also view other titles in our full I-007e Book library here
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Compal Showcases Comprehensive Data Center Solutions at 2025 OCP Global Summit
10/16/2025 | Compal Electronics Inc.Global data centers are facing new challenges driven by AI – greater compute demand, larger working sets, and more stringent energy efficiency requirements. At this year’s OCP Global Summit, Compal Electronics presented a comprehensive vision for the data center of the future, delivering end-to-end solutions that cover compute, memory, and cooling.
Nvidia, Microsoft, and BlackRock Lead $40 Billion Deal to Acquire Aligned Data Centers
10/16/2025 | I-Connect007 Editorial TeamA consortium including Nvidia, Microsoft, BlackRock, and Elon Musk’s xAI has agreed to buy Aligned Data Centers in a deal valued at about $40 billion, marking one of the largest-ever data infrastructure acquisitions as tech giants race to expand capacity for artificial intelligence, the Associated Press reported on Oct. 14
TI’s New Power-management Solutions Enable Scalable AI Infrastructures
10/14/2025 | Texas InstrumentsTexas Instruments (TI) debuted new design resources and power-management chips to help companies meet growing artificial intelligence (AI) computing demands and scale power-management architectures from 12V to 48V to 800 VDC.
Yamaha Boosts Surface-Mount Programming Efficiency with Latest Software Release
10/14/2025 | Yamaha Robotics SMT SectionYamaha Robotics SMT Section has introduced enhanced software tools to accelerate new product introduction (NPI) using YSUP-PG, the program generator for the company’s surface-mounters and inspection systems.
Western Digital Opens Expanded System Integration Test Lab to Accelerate Innovation in the AI and Cloud Era
10/14/2025 | BUSINESS WIREWestern Digital, the backbone of the AI-driven data economy, announced the opening of its expanded System Integration and Test (SIT) Lab, a state-of-the-art 25,600 square foot facility designed to accelerate customer success and unlock faster time to value.