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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
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AT&S Supplies High-tech Components for New Leica M 11
February 9, 2022 | AT&SEstimated reading time: 1 minute
For more than a century, the name Leica has stood for lenses and cameras with the highest quality, first-class workmanship “Made in Germany” and ease of use. Whether photography beginners, ambitious amateur, or professional photographers – they all gladly rely on the high-quality high-tech products from the Leitz Park in Wetzlar (Germany), the corporate headquarters of Leica Camera AG.
With the new Leica M11, the company is once again setting a milestone, combining the unique experience of traditional rangefinder photography with state-of-the-art camera technology. At the heart of the new M generation in the iconic Leica design is a full-frame BSI CMOS sensor with triple resolution technology: raw files in DNG format or JPEGs can be created with a resolution of either 60, 36, or 18 megapixels. Thus, the M11 offers even more flexibility and allows shooting in outstanding image quality.
This is where AT&S, as a development partner of innovative PCB and interconnection technologies, comes into play: A total of twelve different AT&S circuit boards are included in the new M11, including the solutions for integrating the image sensor and image processing. “The trust that a premium manufacturer like Leica places in AT&S products and solutions once again confirms our company’s solution expertise and technological capabilities,” says AT&S CEO Andreas Gerstenmayer.
The printed circuit boards are manufactured both at the Hinterberg site and at the AT&S plant in Korea. The use of special AT&S technologies that allow very compact and flexible electronic interconnection solutions makes it possible for Leica to build digital cameras that offer maximum performance in the smallest possible space while consuming very little energy.
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Imec Launches University Consortium Around Next Generation of Chips
03/13/2026 | ImecImec, a world-leading research and innovation hub in advanced semiconductor technologies, has launched a first of its kind consortium with 26 European university groups that will jointly work on the technology roadmap beyond CMOS scaling (CMOS 2.0).
SMTA Dallas Electronics Manufacturing Expo & Tech Forum Returns April 7 in Plano, Texas
03/12/2026 | SMTAThe SMTA Dallas Electronics Manufacturing Expo & Tech Forum will be returning to the Plano Event Center on Tuesday, April 7, 2026.
Foxconn Technology Awards Introduce New Category with NT$250,000 Top Prize
03/12/2026 | FoxconnThe “2026 Foxconn Technology Award”, organized by the Foxconn Education Foundation, will be open for submissions from March 16 to April 24 , demonstrating its commitment to cultivating high-level R&D talent in Taiwan.
Automating the Repeatable Parts of Hardware Design
03/12/2026 | Kyle Dumont, AllSpice.ioDespite working on some of the most sophisticated technology in the world, many hardware engineers still rely on spreadsheets, tribal knowledge, and sometimes, quite literally, pen, paper, and a highlighter. Delivering new hardware products on schedule often comes down to finding a needle in a haystack disguised as a 900-page specification or datasheet. AllSpice.io set out to automate the repeatable parts of hardware design: the well-defined, rules-based tasks that make sure nothing gets missed and everything lines up.
Ynvisible Partners with Sapphiros for Exclusive E‑Paper Supply for Diagnostic Devices
03/11/2026 | Ynvisible Interactive Inc.Ynvisible Interactive Inc., a leader in printed e-paper display technology, is pleased to announce it has received a Letter of Intent (LOI) from Sapphiros, a privately held consumer diagnostics company, to establish Ynvisible as an exclusive supplier of displays for certain lateral flow and molecular diagnostic tests manufactured by Sapphiros.