-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
AT&S Supplies High-tech Components for New Leica M 11
February 9, 2022 | AT&SEstimated reading time: 1 minute
For more than a century, the name Leica has stood for lenses and cameras with the highest quality, first-class workmanship “Made in Germany” and ease of use. Whether photography beginners, ambitious amateur, or professional photographers – they all gladly rely on the high-quality high-tech products from the Leitz Park in Wetzlar (Germany), the corporate headquarters of Leica Camera AG.
With the new Leica M11, the company is once again setting a milestone, combining the unique experience of traditional rangefinder photography with state-of-the-art camera technology. At the heart of the new M generation in the iconic Leica design is a full-frame BSI CMOS sensor with triple resolution technology: raw files in DNG format or JPEGs can be created with a resolution of either 60, 36, or 18 megapixels. Thus, the M11 offers even more flexibility and allows shooting in outstanding image quality.
This is where AT&S, as a development partner of innovative PCB and interconnection technologies, comes into play: A total of twelve different AT&S circuit boards are included in the new M11, including the solutions for integrating the image sensor and image processing. “The trust that a premium manufacturer like Leica places in AT&S products and solutions once again confirms our company’s solution expertise and technological capabilities,” says AT&S CEO Andreas Gerstenmayer.
The printed circuit boards are manufactured both at the Hinterberg site and at the AT&S plant in Korea. The use of special AT&S technologies that allow very compact and flexible electronic interconnection solutions makes it possible for Leica to build digital cameras that offer maximum performance in the smallest possible space while consuming very little energy.
Suggested Items
DuPont, Zhen Ding Technology Group Sign Strategic Cooperation Agreement to Advance High-End PCB Technology Development
10/30/2024 | DuPontDuPont and Zhen Ding Technology Group announced they have entered into a strategic cooperation agreement in advanced printed circuit board (PCBs) technology.
Wearable Technology Market worth $152.82 Billion by 2029
10/30/2024 | PRNewswireThe global wearable technology market is expected to be valued at USD 70.30 billion in 2024 and is projected to reach USD 152.82 billion by 2029; it is expected to grow at a CAGR of 16.8% from 2024 to 2029 according to a new report by MarketsandMarkets™.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.
Keysight, ADI Partner to Develop GMSLTM Test Methodology
10/30/2024 | BUSINESS WIREKeysight Technologies, Inc. and Analog Devices, Inc. (ADI), a global semiconductor leader, have collaborated to create a comprehensive test solution for Gigabit Multimedia Serial Link (GMSL2TM) devices.
ULVAC Launches Technology Center PYEONGTAEK for Next-Gen Semiconductor Manufacturing
10/30/2024 | JCN NewswireULVAC, Inc., the world’s leading comprehensive vacuum manufacturer, has established Technology Center PYEONGTAEK in Pyeongtaek, Gyeonggi-do, South Korea.