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Advanced Electronics Packaging Digest

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Benchmark Expands U.S. Manufacturing for Oxide Computer Company

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Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, announced expanded U.S. production for Oxide Computer Company, the on-premises cloud computing company and creator of the Oxide Cloud Computer.

Compal, ARC Cloud Forge Strategic Partnership to Accelerate Large-Scale AI Infrastructure

10/27/2026 | PRNewswire
Compal Electronics, Inc. and ARC Cloud announced the signing of a Memorandum of Understanding (MOU) to advance their strategic collaboration in large-scale AI computing infrastructure.

LITEON September Sales Rise 22% on Strong AI and Cloud Demand

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LITEON’s consolidated revenue for September reached NT$18.8 billion, representing a 22% Y-o-Y increase.

Flex Acquires EPC Power to Expand AI Data Center Power Solutions

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IC-Link by imec Expands TSMC Collaboration for Advanced-Node Chip Design

10/01/2026 | Imec
IC-Link by imec, imec’s design and manufacturing service provider for ASICs and silicon photonics, and TSMC announced an expansion of their collaboration aimed at simplifying customer access to advanced-node semiconductor design capabilities.
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