L3Harris Completes Imager Integration for NOAA’s Advanced Environmental Satellite
February 21, 2022 | Business WireEstimated reading time: Less than a minute

The fourth Advanced Baseline Imager (ABI) built by L3Harris Technologies has been successfully integrated into NOAA’s Geostationary Operational Environmental Satellite-U (GOES-U), completing the series of advanced weather sensors for the GOES program, slated to launch in 2024.
The ABIs onboard the GOES series of satellites provide revolutionary technology by advancing weather observation and environmental monitoring services, and also by providing more advanced notice of fires, hurricanes, tornadoes and floods. The ABI provides high-resolution video of weather and environmental systems using 16 spectral bands delivering three times the amount of spectral coverage, four times the resolution and five times faster than the previous generation of GOES satellites.
For nearly 60 years, L3Harris has developed breakthrough technology and launched innovative solutions that further improve the accuracy of weather forecasts, measure climate change and increase life-saving warning times.
The third ABI is onboard NOAA’s GOES-T satellite, scheduled to launch March 1, 2022. GOES satellites are under command and control of the L3Harris-built enterprise ground system.
Suggested Items
TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity
03/13/2025 | TSMCMediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TCT Circuit Supply and Electra Polymers Announce New Strategic Partnership
03/12/2025 | Electra Polymers LtdTCT Circuit Supply (TCS) is excited to announce a new strategic partnership with Electra Polymers, a global leader in advanced specialty polymer products
Critical Manufacturing to Show You Might Need a New MES for Making Industry 4.0 A Reality at IPC APEX EXPO 2025
03/10/2025 | Critical ManufacturingCritical Manufacturing, a leader in advanced Manufacturing Execution Systems (MES) and a subsidiary of ASMPT, will show visitors to IPC APEX EXPO 2025 that the company’s MES - complete with extensive features specific to the electronics industry - can serve as a true Industry 4.0 platform. Any electronics manufacturer looking to turn its vision of digital transformation from concept into reality should prioritize visiting Critical Manufacturing at ASMPT SMT Booth 1813.
Multicircuits Expands Capabilities with State-of-the-Art Automated Copper Via Fill Process
03/10/2025 | MulticircuitsMike Thiel, president of Multicircuits, a leading provider of high-reliability printed circuit boards, has announced the addition of a state-of-the-art automated copper via fill process to their advanced manufacturing capabilities. This strategic investment enhances the company’s ability to deliver cutting-edge solutions for demanding industries, including aerospace, defense, medical, and high-speed telecommunications.