Global Sourcing Spotlight: How Travel Has Enhanced My Life and Work
Material Insight: Diversifying PCB Manufacturing Through Nearshoring
Standard of Excellence: Looking Five Years Into the FutureL3Harris Completes Imager Integration for NOAA’s Advanced Environmental Satellite
February 21, 2022 | Business WireEstimated reading time: Less than a minute
The fourth Advanced Baseline Imager (ABI) built by L3Harris Technologies has been successfully integrated into NOAA’s Geostationary Operational Environmental Satellite-U (GOES-U), completing the series of advanced weather sensors for the GOES program, slated to launch in 2024.
The ABIs onboard the GOES series of satellites provide revolutionary technology by advancing weather observation and environmental monitoring services, and also by providing more advanced notice of fires, hurricanes, tornadoes and floods. The ABI provides high-resolution video of weather and environmental systems using 16 spectral bands delivering three times the amount of spectral coverage, four times the resolution and five times faster than the previous generation of GOES satellites.
For nearly 60 years, L3Harris has developed breakthrough technology and launched innovative solutions that further improve the accuracy of weather forecasts, measure climate change and increase life-saving warning times.
The third ABI is onboard NOAA’s GOES-T satellite, scheduled to launch March 1, 2022. GOES satellites are under command and control of the L3Harris-built enterprise ground system.
Share on:
Suggested Items
Lockheed Martin-Built GOES-U Weather Satellite Successfully Launched
07/01/2024 | Lockheed MartinAn advanced weather satellite built by Lockheed Martin for the National Oceanic and Atmospheric Administration (NOAA) launched from NASA's Kennedy Space Center.
SEMI Applauds U.S. Chips Act Award For Entegris Semiconductor Materials Facility in Colorado
07/01/2024 | SEMISEMI, applauded the United States Department of Commerce's announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support Entegris construction of a state-of-the-art manufacturing center for advanced materials and process solutions for leading-edge semiconductors in Colorado Springs, Colorado.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/28/2024 | Andy Shaughnessy, Design007 MagazineMuch of our recent coverage focuses on being ready for the future—technologically and otherwise. We have news about APCT relaunching as AdvancedPCB, and an interview with Freedom CAD’s Scott Miller about their new leadership—young managers who bring new vision to the company. We also have coverage of “Bold Breakthroughs: Women Reshaping the Engineering Landscape,” a webinar that celebrates Women in Engineering Day. We bring you an interview with Ventec’s Alun Morgan, who discusses the advent of glassless materials, and an article by FCT’s Chris Clark about cost-drivers in the flex and rigid-flex arena.
MacDermid Alpha Electronics Solutions Launches MICROFAB SC-40 PLUS
06/28/2024 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions Launches MICROFAB SC-40 PLUS to meet the latest advancements in semiconductor manufacturing.
APCT Launches as AdvancedPCB, Combines Industry Leaders Under One Brand
06/27/2024 | PRNewswireAdvancedPCB, a leader in printed circuit board (PCB) design and manufacturing, announces its launch, combining Advanced Printed Circuit Technology (APCT), Advanced Circuits, Inc. (ACI), and San Diego PCB Design (SDPCB), into a next-generation PCB manufacturer.