Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
American Made Advocacy: Congress Back from Break With Work To Do
Insituware Announces 2022 Top Hat Awards to Top Three Reps
February 22, 2022 | Insituware LLCEstimated reading time: Less than a minute
Insituware LLC, the developer of the first smart measurement solution for quality control of materials, is pleased to announce that it presented the 2022 Top Hat Awards to the top three reps of the year during the recent 2022 IPC APEX EXPO in San Diego. The criteria for the Top Hat Awards include product line launch support, sales performance, and tenaciousness and drive.
The 2022 Top Hat Awards winners are:
RON TORENKO – Torenko & Associates
For actively promoting and launching Insituware’s product lines in his territory.
DAVID SMITH – Horizon Sales
For sales performance and overwhelming commitment to servicing customers' needs in his territory.
DAVE MURRIN – Ark Manufacturing
For sales performance in his territory and his contribution of valuable insights in support of Insituware's new products.
Insituware’s representative team provides world-class customer sales and support while Insituware continues to develop new materials control solutions for manufacturers to help them drive towards Industry 4.0. The proven, award-winning Vision MARK-1 device is powered by analytical sensors, machine learning, and cloud-based technology to bring materials control solutions right on the factory floor.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.