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KIC to Exhibit at the SMTA Dallas Expo
February 24, 2022 | KICEstimated reading time: Less than a minute
KIC will exhibit at the SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 22, 2022 at the Plano Event Center.
KIC has thermal process solutions for NPI process setup, automatic profiling and data reporting, easy process audits, process traceability, MES/CFX connectivity and more.
Electronics manufacturing today requires automated and real-time process control and traceability. KIC provides solutions for real-time inspection of the reflow/cure/wave process, like SPI and AOI provide optical inspection for printing and placement.
KIC will display the latest addition to the thermal process inspection family – the award-winning Wave Process Inspection system. As the RPI does for reflow, wave process inspection (WPI) provides users with automatic profiling -- including an industry first dwell time and parallelism measurement for each production board -- real-time preheat and wave analytics, automatic SPC charting and more.
For 45 years KIC has provided solutions for automated thermal process data collection and analytics, with service and support offices in every region. As the market leader and industry standard, there are more than 25,000 systems in the field bringing value and the most reliable, accurate and innovative solutions for electronics manufacturing thermal process challenges.
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"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
Marcy’s Musings: From Pitch to PO—The Sales Stack
07/21/2025 | Marcy LaRont -- Column: Marcy's MusingsIt is a foundational truth that a company lives and dies by its sales. Receiving that PO or contract starts the operational chain. It is the purest symbol of the machinations of the business process: You are paying me for something I am doing, making, or sourcing for you. Then, every single thing a business does in executing and fulfilling that sales agreement speaks directly to customer experience and whether more POs will follow. You won't keep customers if you don't make a quality product and provide strong customer service.
July 2025 PCB007 Magazine: Sales—From Pitch to PO
07/18/2025 |Though all parts of a company are essential for holistic success, it is a foundational truth that a company lives and dies by its sales. If there are no sales, the company eventually ceases to exist, or as Henry Ford says, “Nothing happens until someone sells something.” In the July issue of PCB007 Magazine, we break down the sales stack and provide a guide to up your sales game.
Tightening of LPDDR4X Supply Drives Up Prices; Smartphone Brands to Accelerate Adoption of LPDDR5X
07/17/2025 | TrendForceTrendForce’s latest investigations reveal that major Korean and U.S. memory suppliers are expected to significantly reduce or even cease production of LPDDR4X in 2025 and 2026.
Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.