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MacDermid Alpha Releases CircuEtch 300 Anisotropic Final Etch for SAP and mSAP
February 24, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute

MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provide unmatched capabilities in electronics design and manufacturing, announces the release of CircuEtch 300, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.
The CircuEtch 300 high-speed anisotropic etch process is the latest addition to the MacDermid Alpha process family for the manufacturing of the advanced HDI and IC substrates. The CircuEtch series of processes are high performance etch formulas that can be utilized for processing of mSAP and SAP manufacturing of high-density interconnects with excellent precision and overall conductor geometry. CircuEtch 300 has a wide operating window and the etch rate can be adjusted to meet specific process requirements for different types of substrates. The CircuEtch 300 also provides the additional benefit of reducing the surface roughness of the pattern plated electrolytic copper traces for improved electrical properties.
CircuEtch 300 is non-flammable so it eliminates flammable materials shipping and storage concerns which also results in a safer workplace. The new CircuEtch 300 precisely defines traces with optimal geometry, zero undercut, and vertical trace sidewalls for excellent electrical performance. The bath has a predictable etching rate over a wide range of additive, copper, acid, chloride concentration and operating temperatures, while running in easy to maintain horizontal spray etching equipment.
For more information on CircuEtch 300, please visit MacDermidAlpha.com.
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Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
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The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.