Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
AT&S’ Magnetic Inlays: Mini Electromagnets for Wireless Charging
March 1, 2022 | AT&SEstimated reading time: 2 minutes
As part of an EU research project, AT&S is developing the next generation of miniaturized inductors that can be integrated into multi-layer printed circuit boards. This makes it possible to implement the smallest voltage converters or ultra-thin, wireless charging devices, which have several advantages compared to the technology currently available.
If you want to supply an electric car with electricity or charge your mobile phone wirelessly, you have to rely on electromagnets, which consist of a core made of ferromagnetic material and a coil wound around it. Such magnetic components are ubiquitous in the electrical and electronics industry and the basis for technical progress in many areas. That is why the European Union, as part of its IPCEI initiative (Important Projects of Common European Interest) in the field of microelectronics, has made research into the next generation of such components a priority.
AT&S is also involved in the project together with more than 30 partners from industry and research. The Styrian high-tech group uses its experience and production capacities in the manufacture of highly complex printed circuit boards to create small electromagnets, which in turn are the basis for integrated components such as inductors or transformers. AT&S engineers are already demonstrating first prototypes, such as a wireless charging device for mobile phones with a printed circuit board just one millimetre thick, at trade fairs.
Micro drilling is reliable
“The magnetic components that are state of the art today are often wound by hand in low-wage countries. With our know-how from printed circuit board production, we can not only manufacture thinner components but also significantly improve reliability,” says Gerald Weidinger, who heads development at AT&S. Instead of winding an actual wire around an iron core, the windings are realized with the finest of holes around a tiny ring of special magnetic materials that have been embedded in circuit board material.
“We drill through the core of the circuit board inside and outside the ring, the holes are then plated with copper and connected with traces below and above the magnet ring. This creates an embedded electromagnet,” says Weidinger. With this technology, thousands of such elements can be produced in parallel on a single panel. This also enables automated quality control, which contributes to the superior reliability of the magnetic elements.
Small is beautiful
AT&S is currently working on perfecting the technology for customers. By expanding the possible performance ranges, additional applications are to be opened up. In addition to smaller wireless chargers and more efficient power supply circuits, the technology is also being expanded to make tiny electromagnets in shapes other than the toro+ids described above. Magnetic layers inside a printed circuit board can also be used to shield sensitive electronic circuits from each other.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.