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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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AT&S’ Magnetic Inlays: Mini Electromagnets for Wireless Charging
March 1, 2022 | AT&SEstimated reading time: 2 minutes
As part of an EU research project, AT&S is developing the next generation of miniaturized inductors that can be integrated into multi-layer printed circuit boards. This makes it possible to implement the smallest voltage converters or ultra-thin, wireless charging devices, which have several advantages compared to the technology currently available.
If you want to supply an electric car with electricity or charge your mobile phone wirelessly, you have to rely on electromagnets, which consist of a core made of ferromagnetic material and a coil wound around it. Such magnetic components are ubiquitous in the electrical and electronics industry and the basis for technical progress in many areas. That is why the European Union, as part of its IPCEI initiative (Important Projects of Common European Interest) in the field of microelectronics, has made research into the next generation of such components a priority.
AT&S is also involved in the project together with more than 30 partners from industry and research. The Styrian high-tech group uses its experience and production capacities in the manufacture of highly complex printed circuit boards to create small electromagnets, which in turn are the basis for integrated components such as inductors or transformers. AT&S engineers are already demonstrating first prototypes, such as a wireless charging device for mobile phones with a printed circuit board just one millimetre thick, at trade fairs.
Micro drilling is reliable
“The magnetic components that are state of the art today are often wound by hand in low-wage countries. With our know-how from printed circuit board production, we can not only manufacture thinner components but also significantly improve reliability,” says Gerald Weidinger, who heads development at AT&S. Instead of winding an actual wire around an iron core, the windings are realized with the finest of holes around a tiny ring of special magnetic materials that have been embedded in circuit board material.
“We drill through the core of the circuit board inside and outside the ring, the holes are then plated with copper and connected with traces below and above the magnet ring. This creates an embedded electromagnet,” says Weidinger. With this technology, thousands of such elements can be produced in parallel on a single panel. This also enables automated quality control, which contributes to the superior reliability of the magnetic elements.
Small is beautiful
AT&S is currently working on perfecting the technology for customers. By expanding the possible performance ranges, additional applications are to be opened up. In addition to smaller wireless chargers and more efficient power supply circuits, the technology is also being expanded to make tiny electromagnets in shapes other than the toro+ids described above. Magnetic layers inside a printed circuit board can also be used to shield sensitive electronic circuits from each other.
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Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.