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PARMI USA Announces New Partnership with Technica USA for Expanded Market Presence

02/13/2025 | Technica USA
PARMI USA, INC., a leader in advanced 3D inspection systems, is pleased to announce a new Distribution and Representative Agreement with Technica USA, marking a significant milestone in the company’s strategy to deliver leading-edge inspection solutions to electronics manufacturers across North America.

Foxconn Floats Partnership with Struggling Nissan

02/12/2025 | I-Connect007 Editorial Team
Struggling Nissan, who was Japan’s second largest automaker after Toyota until 2020, continues to be in the news. As talks have broken down with Honda, who it was announced would acquire Nissan several weeks ago, Foxconn appears to be joining the discussing, or trying. 

CEE PCB Appoints Markus Voeltz to Business Development Director Europe

02/12/2025 | CEE PCB
CEE PCB, a leading manufacturer of printed circuit boards (PCBs) and flexible printed circuits (FPCs) with 3 production facilities in China, is expanding its presence in Europe and will offer local support starting March 2025.

Accuron Technologies Acquires Majority Stake in Trymax Semiconductor

02/11/2025 | Accuron Technologies
Accuron Technologies, a global precision engineering and technology group, today secures a controlling interest in Trymax Semiconductor Equipment, a specialist in plasma-based and UV-based process equipment and solutions for semiconductor manufacturers.

LQDX, Arizona State University Sign Semiconductor Packaging Collaboration Agreement

02/11/2025 | LQDX
LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal agreement with Arizona State University (ASU) to further its partnership which began in 2024, focused on advanced IC-substrates, Fan Out Wafer Level Packaging (FOWLP) and glass core metallization, as enabled by its Liquid Metal Ink (LMI®) technology.
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