Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Marcy’s Musings: Can You Hear the Voices?
Facing the Future: Successfully Navigating the Uncertain Path Ahead
Cadence Recognized with TSMC OIP Ecosystem Forum Customers’ Choice Award for 3D-IC Design
March 2, 2022 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced that it has received a TSMC Open Innovation Platform (OIP) Ecosystem Forum Customers’ Choice award for a paper titled, “Integrated Platform for 3D-IC Design,” which was presented during the TSMC 2021 North America OIP Ecosystem Forum. Cadence’s Thunder Lay, software engineering director, presented the paper, highlighting the benefits of the recently introduced Cadence® Integrity™ 3D-IC platform, the industry’s first comprehensive, unified platform for 3D-IC design planning, optimization, implementation and signoff.
With 3D-IC packaging increasing in popularity due to today’s design requirements, the Cadence paper received the highest average score among forum attendees. Designers learned how the Integrity 3D-IC platform enables system-driven power, performance and area (PPA) for individual chiplets through integrated thermal, power and static timing analysis capabilities. The platform is ideal for customers creating emerging hyperscale computing, consumer, 5G communications, mobile and automotive applications and supports TSMC’s 3DFabric™ technologies. For more information on the Integrity 3D-IC platform, please visit www.cadence.com/go/integrity3dic.
“The Integrity 3D-IC platform helps customers address top-level 3D-IC design aggregation and management, system-level analysis and signoff challenges, and the costly overdesign of individual dies,” said Don Chan, vice president, Research & Development. “What really sets the Integrity 3D-IC platform apart from other industry solutions is that it is tightly integrated with Cadence analysis tools, providing customers with an extra benefit of system-driven PPA. The Customers’ Choice Award recognition reflects our strong 3D-IC collaboration with TSMC, and we look forward to working with mutual customers to enable them to achieve design goals with our new platform and TSMC’s 3DFabric technologies.”
“Cadence’s paper explained how the integrated Integrity 3D-IC platform in conjunction with TSMC’s advanced 3DFabric technologies enable a system-level approach to product design to improve PPA and time to market,” said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. “I’m delighted to congratulate Cadence on winning this Customers’ Choice Award and am looking forward to our continued collaboration with Cadence to enable cutting-edge 3D-IC designs and help customers accelerate innovation of their differentiated products.”
The Integrity 3D-IC platform offers an efficient solution to deploy 3D design and analysis flows for the creation of robust, silicon-stacked designs. The platform is part of the Cadence digital and signoff product portfolio and aligns with the broader Cadence Intelligent System Design strategy, enabling system-on-chip (SoC) design excellence.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
Electronic System Design Industry Posts $4.9 Billion in Revenue in Q4 2024
04/15/2025 | SEMIElectronic System Design (ESD) industry revenue increased 11% to $4,927.3 million in the fourth quarter of 2024 from the $4440.9 million reported in the fourth quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
04/17/2025 | Matt Stevenson -- Column: Connect the DotsIf you have read any of my earlier columns, you know I am passionate about helping designers design for the reality of manufacturing. Designing for manufacturability (DFM) is a team sport. DFM is a design process that looks forward to the manufacturing process and integrates with it so that manufacturing requirements and capabilities can be accurately reflected in the design work.
Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead
04/17/2025 | Jerome Larez -- Column: Global PCB ConnectionsHigh density interconnect (HDI) printed circuit boards have come a long way from their origins as a niche technology for miniaturized applications. Today, HDI PCBs are at the forefront of innovation, driven by an insatiable demand for faster, smaller, and more powerful electronic devices. As consumer electronics, 5G infrastructure, and AI-driven systems advance, design engineers must stay ahead of the curve to ensure their PCB designs meet evolving industry demands.