Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
MacDermid Alpha to Present on High Reliability Materials for 3D Structural Electronics at LOPEC 2022 Exhibition and Conference
March 14, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global leader of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in innovative electronics design and manufacturing, will be presenting the technical paper “Next Generation Interconnect Materials for Smart, Functional, and 3D HMI Surfaces” at the LOPEC 2022 Exhibition and Conference taking place March 22 - 24, 2022 at the Messe München, Germany.
Dr. Nirmalya Kumar Chaki, Manager, Advanced Materials Research will present his recent research as part of the Functional Materials session. His presentation will focus on three central technologies; compatible electronic inks for In-Mold electronics, formable silver inks, dielectric inks and adhesives, in addition to structural, 3D In-Mold Electronics demonstrators. In-Mold Electronics (IME) technology integrates the existing Film Insert Molding (FIM) process with electronics, which allows for design freedom and manufacturing flexibility, as well as savings in costs, weight reduction and a 30% decrease in carbon footprint. With the addition of conductive circuits using MacDermid Alpha’s electronic inks, only one process is required to produce conformable (non-rectangular/planar/freeform) automotive parts with embedded functional electronics. Applications for this technology in automotive interiors include in-vehicle infotainment, overhead console panels (OHCP), center console, and audio controls.
MacDermid Alpha is developing a suite of conductive inks and materials to meet the unique requirements and reliability standards for Peel-N-Stick Sensors and In-Mold Electronics. We offer a comprehensive suite of fully compatible materials, processing and applications support for our films, electronic inks & adhesives to produce 3D Smart, Functional and 3D Automotive HMI (Human-Machine Interface) Structures. Our film capabilities include functional and decorative solutions, such as Autotype heat-stabilized PET and PC films. Additionally, our electronic materials portfolio provides integrated electronics capabilities for the printed circuit board and semiconductor industries. We provide solutions for the entire electronics device stack, due to the inter-compatibility & adhesion of our substrates and electronic ink layers.
MacDermid Alpha’s products for Peel-N-Stick Sensors & IME include:
- Formable PET & PC Films / Substrates
- Formable Conductive Inks
- Formable Dielectric Inks
- Electronic Joining Materials
Dr. Chaki will be delivering his paper on Wednesday, March 23 at 5:20 pm. To register for the presentation, please visit the LOPEC website.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.