Qualcomm, BMW Group and Arriver to Form Long-lasting Strategic Cooperation
March 15, 2022 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
Qualcomm Technologies, Inc., BMW Group and Arriver Software AB announced a long-term development cooperation for the development of Automated Driving technologies. The companies signed an agreement for a strategic cooperation, which will focus on joint development of next-generation AD technologies ranging from New Car Assessment Program (NCAP), Level 2 Advanced Driving Assistance Systems to Level 3 High Automated Driving functionalities. The co-development of software functions is based on the current BMW Automated Driving software stack first launched with the BMW iX in 2021, which will be further extended in the next generation through this cooperation. In November 2021 the companies announced that BMW’s next generation Automated Driving System will be ported on the Snapdragon Ride™ Vision system-on-chip (SoC) including Arriver Computer Vision and the Snapdragon Ride Platform’s compute SoC controllers managed by Snapdragon® Car-to-Cloud Services platform.
The efforts will focus on creating a scalable platform for automated driving based on a common reference architecture, sensor-set specifications, and safety requirements with joint development, toolchain, and a data center for storage, reprocessing, and simulation. The cooperation will see more than 1,400 specialists working together in locations worldwide, including Germany, USA, Sweden, China, Romania, and the BMW AD Test Center in Czech Republic.
“This joint software development is an important milestone for the BMW Group with regards to our next generation Automated Driving platform. To enable sophisticated and safe functionalities in a vehicle you need state-of-the art software in all components of the digital value chain. This forms the backbone for intelligent driver assistance systems. The BMW Group is excited to further extend our partnership with global technology leaders Qualcomm Technologies and Arriver to include a long-lasting strategic co-development cooperation in order to continue delivering world-class driving experiences to our customers,” said Nicolai Martin, Senior Vice President Driving Experience, BMW Group.
“We are proud of this long-term cooperation with the BMW Group and Arriver which focuses on co-development and deployment of Automated Driving systems from NCAP to Level 3 customer functionality in BMW upcoming series production vehicles,” said Nakul Duggal, Senior Vice President and General Manager Automotive, Qualcomm Technologies, Inc. ”Building on already commercialized stack components from BMW Group and Arriver, this cooperation will position us to extend BMW Automated Drive software to the Snapdragon Ride platform, and expand the accessibility of safer self-driving technologies to other automakers and Tier-1s in an open, flexible and scalable deployment framework. We believe Snapdragon Ride will create significant economies of scale and time-to-market benefits across the automotive industry with the launch of the automated driving software globally in BMW’s series production vehicles, which have always been an exemplar of the highest quality, performance and safety standards in modern day automobiles.”
“We are pleased that Arriver’s Vision Perception and market proven NCAP features will be combined with the BMW Automated Driving software stack. Joining forces with Qualcomm Technologies and BMW Group Arriver’s team will co-develop the next generation of open and scalable Drive Policy with world-class feature solutions and performance. This co-developed product will be offered to our customers globally. This cooperation is a key milestone for Arriver and a proof point of the rich competence of our teams through years of experience in ADAS & safety,” said Giuseppe Rosso, President and Managing Director, Arriver.
Qualcomm Technologies, BMW Group and Arriver are working closely together to establish and continuously develop an ecosystem for automated driving solutions but remain open to further partnerships.
Suggested Items
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
T-Global Technology Offers Solutions for Thermal Management Challenges
04/10/2024 | I-Connect007 Editorial TeamJames Hopkins from T-Global discusses the company's focus on thermal management products, including thermal interface materials, heat sinks, and thermal simulation services. He highlights the importance of collaborating with mechanical engineers and addressing challenges in balancing thermal performance and mechanical requirements. Hopkins also mentions the role of thermal simulation in guiding product recommendations and the significance of early collaboration among stakeholders for optimal product outcomes.
The Exploration Company Leverages Ansys to Promote Sustainability in Space
04/05/2024 | ANSYSSpace logistics startup The Exploration Company is advancing sustainable space exploration by leveraging Ansys simulation solutions to develop its modular and reusable space vehicle, Nyx.
Ansys Forms OEM Partnership with SynMatrix to Accelerate RF Filter Design
04/01/2024 | ANSYSAnsys announced a new OEM partnership with SynMatrix to streamline RF filter design workflows for wireless communications applications. SynMatrix develops industry-leading RF filter design and optimization tools that integrate with HFSS electromagnetic simulation.
Altair SimSolid Transforms Simulation for Electronics Industry
03/29/2024 | AltairAltair, a global leader in computational intelligence, announced the upcoming release of Altair SimSolid for electronics, bringing game-changing fast, easy, and precise multi-physics scenario exploration for electronics, from chips, PCBs, and ICs to full system design.