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Advanced Electronics Packaging Digest

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Foxconn Launches Second-Gen LEO Satellite, Begins Inter-Satellite Link Testing

05/05/2026 | Foxconn
Foxconn Technology Group, the world's largest electronics manufacturing services provider, announced that its second-generation low-Earth orbit (LEO) satellites, "Pearl-1A" and "Pearl-1B," were successfully launched into their designated orbits via SpaceX's Falcon 9 rocket on the evening of May 3 (Taipei time).

Siemens Collaborates with TSMC to Advance AI for Semiconductor Design

04/22/2026 | Siemens
Siemens announced the continuation of collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.

Controlar Introduces PicAI to Strengthen Probe Inspection in Electronics Manufacturing

04/16/2026 | Controlar
Controlar is bringing a new level of precision and control to electronics testing with the launch of PicAI (AI-Driven Probe Inspection Control), a fully automated system designed to replace manual ICT fixture verification in high-reliability environments.

Smart Automation: Preparing for an SMT Line Upgrade—Materials and Setup Verification

02/18/2026 | Josh Casper -- Column: Smart Automation
When exploring increased throughput of an SMT line, many manufacturers, of course, start with the line itself. This makes sense: Upgrading to a higher speed pick-and-place, adding feeder capacity, and optimizing handling should result in faster throughput. However, the smartest place for most mid-sized manufacturers to start is with materials and setup verification.

Cadence Launches ChipStack AI Super Agent for Next-Gen Chip Design

02/16/2026 | Cadence Design Systems
Cadence announced a transformative step forward in redefining how semiconductors are designed with the launch of the ChipStack™ AI Super Agent—an agentic AI solution for front-end silicon design and verification.
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