Heraeus Electronics Returns to APEC with Presentation on Advanced Interconnection Technologies

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For the first time since 2019 the Applied Power Electronic Conference will return to a live format in Houston, Texas, March 20-23. Heraeus Electronics’ Habib Mustain, Power Electronics Segment Manager for Heraeus Electronics will present on Advanced Interconnections for Power Electronics. With new technologies in the industry, traditional silicon devices for high performance power electronics are not suitable anymore for these demanding applications. Wide band gap semiconductors are the successors to these traditional devices and with the new generation of power modules and systems, they require engineered matched materials that are tailored to the application.

Heraeus Electronics’ presentation will focus on the top-side interconnections, like wire-bonding and die attach solutions with various sintering materials in the presentation. Habib Mustain says, “the direction of the Power Electronics industry and the application requirements need to address higher temperature requirements, reliability, and reduce complexity in the evolving power electronic trends.”

Join Heraeus Electronics at this year’s APEC 2022 on Wednesday, March 23, 2022 at 11:05am CST to hear Habib’s presentation on the importance of matched materials solutions in power electronics. While at the conference visit Heraeus Electronics at booth# 715 to speak more with Habib and the other experts on this topic or other requirements for your power module. Heraeus Electronics full portfolio of metal ceramic substrates, bonding wire, and material systems will be on display.

Global Marketing Manager Mark Challingsworth says, “APEC has always been a great exhibition for the power electronic industry. Some of the industries brightest minds come together under one roof and provide knowledge and innovations that advance power electronics into the future.”