Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services
March 24, 2022 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
Cadence Design Systems, Inc. announced that GlobalFoundries® (GF®) has qualified the Cadence® digital solution on Amazon Web Services (AWS). The qualification of the digital solution on GF’s 22FDX™ platform enables customers to achieve cloud scalability, efficiency and productivity, while also attaining optimal design power, performance and area (PPA) and faster time to market.
Design teams need tools that can keep pace with the increasing complexity and serve a broad range of end markets and applications. The integrated Cadence digital solution, combined with the power of the cloud, helps customers address these latest design challenges by providing a fast path to design closure and better predictability for meeting PPA targets. For example, Xenergic, a company that provides ultra-low-power and high-performance on-chip memory solutions, used the Cadence Cloud Passport featuring the digital full flow and the Cadence Tensilica® Fusion F1 DSP on the GF 22FDX platform to successfully tape out a low-power memory first-time right test chip.
“Xenergic’s successful tapeout shows that customers can design with confidence in the cloud using the Cadence digital full flow and the Tensilica Fusion F1 DSP, which are qualified for use on the differentiated GF 22FDX process,” said KT Moore, vice president, Corporate Marketing at Cadence. “Through our collaboration with AWS and GF, we’re enabling customers to leverage the power of the cloud for the creation of next-generation designs that support emerging markets like automotive and IoT.”
“Building on the success of our 22FDX design flow with the Cadence digital solution, our ongoing collaboration takes us to the next level with a fully cloud-based implementation that provides flexibility and performance for our joint customers,” said Mark Ireland, vice president, Ecosystem and Design Solutions at GF. “Our engagement with Cadence is another example of how GF is partnering with ecosystem leaders to enable our customers to accelerate time-to-market and deliver innovative solutions.”
Xenergic CEO Dr. Babak Mohammadi said, “The cloud-based RTL-to-GDS flow with Cadence’s Tensilica Fusion F1 DSP enabled us to achieve 5X greater productivity with our test chip tapeout. We were successfully able to scale cloud resources during peak needs, and we look forward to continuing to leverage this solution from Cadence, GF and AWS to accelerate development times with our forthcoming low-power product designs.”
The Cadence digital flow includes the Innovus™ Implementation System, Genus™ Synthesis Solution, Quantus™ Extraction Solution, Tempus™ Timing Signoff Solution, Conformal® Smart Logic Equivalence Checker, Physical Verification System and Pegasus™ Layout Pattern Analyzer. The Tensilica Fusion F1 DSP’s highly configurable architecture provides excellent DSP performance—both fixed and floating point—which makes it highly efficient when running the narrowband wireless communications standards typically associated with IoT device communication.
Suggested Items
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
Electronic System Design Industry Posts $4.9 Billion in Revenue in Q4 2024
04/15/2025 | SEMIElectronic System Design (ESD) industry revenue increased 11% to $4,927.3 million in the fourth quarter of 2024 from the $4440.9 million reported in the fourth quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
04/17/2025 | Matt Stevenson -- Column: Connect the DotsIf you have read any of my earlier columns, you know I am passionate about helping designers design for the reality of manufacturing. Designing for manufacturability (DFM) is a team sport. DFM is a design process that looks forward to the manufacturing process and integrates with it so that manufacturing requirements and capabilities can be accurately reflected in the design work.
Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead
04/17/2025 | Jerome Larez -- Column: Global PCB ConnectionsHigh density interconnect (HDI) printed circuit boards have come a long way from their origins as a niche technology for miniaturized applications. Today, HDI PCBs are at the forefront of innovation, driven by an insatiable demand for faster, smaller, and more powerful electronic devices. As consumer electronics, 5G infrastructure, and AI-driven systems advance, design engineers must stay ahead of the curve to ensure their PCB designs meet evolving industry demands.