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Lockheed Martin Demonstrates New Layered Missile Defense Integration for U.S. Army
March 29, 2022 | Lockheed MartinEstimated reading time: 1 minute
Lockheed Martin, the Missile Defense Agency (MDA) and the U.S. Army successfully further integrated the PAC-3 Missile Segment Enhancement (MSE) interceptor into the Terminal High Altitude Area Defense (THAAD) Weapon System – resulting in a more tightly integrated, layered missile defense system.
During a test, the THAAD system successfully launched a PAC-3 MSE to intercept a tactical ballistic missile target using proven Hit-to-Kill technology without the support of a Patriot fire unit, yielding greater flexibility for the warfighter. Integration into the THAAD Weapon System allows the PAC-3 MSE to launch earlier, enabling a longer flyout and the full use of the MSE’s kinematic capability.
“This integration is another Lockheed Martin contribution to joint all-domain operations and offers a critical capability in 21st century security that gives the warfighter more options with existing equipment so they can choose the best interceptor for any threat they face,” said Scott Arnold, vice president, Integrated Air & Missile Defense at Lockheed Martin Missiles and Fire Control.
The test also validates the flexibility of our PAC-3 missiles, which have now successfully launched from THAAD, Patriot and the U.S. Army’s Integrated Air and Missile Defense Battle Command System (IBCS) in flight tests.
Several flight tests led to today’s integration of PAC-3 MSE within THAAD. In a 2020 flight test, a PAC-3 MSE intercepted a target using data provided by THAAD. In an earlier test this year, the THAAD Weapon System launched a PAC-3 MSE interceptor against a virtual threat, demonstrating the successful integration of the PAC-3 MSE interceptor into the THAAD system.
THAAD is the only U.S. system designed for endo-and exo-battlespace, using Hit-to-Kill technology to execute its lethal aim-point accuracy to intercept a threat with direct impact.
PAC-3 MSE is an evolution of the battle-proven PAC-3 Cost Reduction Initiative (CRI) and also uses Hit-to-Kill technology to defend against threats through direct body-to-body contact that delivers exponentially more kinetic energy on the target than can be achieved with blast-fragmentation mechanisms.
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Sweeney Ng - CEE PCBSuggested Items
Sensors: The Invisible Force Behind Modern Convenience and Safety
10/24/2025 | Sanjeev Mane, Brooks AutomationSensors and sensor technology are fundamental components of modern life that drive innovation across various electronics and devices. From smartphones to industrial machinery, these small but powerful tools enable seamless interaction with the environment, ensuring efficiency and safety. This article serves as an introduction and overview of sensor technology, highlighting its significance in modern applications and its growing importance in the market as we embrace smarter, more connected systems.
Technica USA Partners with Creative Electron
10/22/2025 | Technica USATechnica USA is proud to announce the partnership with Creative Electron Inc. located in San Marcos, CA.
MES Software Tools Need Thoughtful Integration
10/21/2025 | Nolan Johnson, SMT007 MagazineThe Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence, connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Analog Devices Launches ADI Power Studio™ and New Web-Based Tools
10/14/2025 | Analog Devices, Inc.Analog Devices, Inc., a global semiconductor leader, announced the launch of ADI Power Studio, a comprehensive family of products that offers advanced modeling, component recommendations and efficiency analysis with simulation. In addition, ADI is introducing early versions of two new web-based tools with a modernized user experience under the Power Studio umbrella: