Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Marcy’s Musings: Can You Hear the Voices?
Facing the Future: Successfully Navigating the Uncertain Path Ahead
M31 Speeds Delivery of Silicon IP by 5X Using the Cadence Library Characterization Solution in the Cloud
March 31, 2022 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced that M31 Technology Corporation has adopted the Cadence CloudBurst platform to complement its existing Cadence Liberate Trio Characterization Suite infrastructure, speeding the delivery of its advanced-node silicon IP. The CloudBurst platform provided easy access to the Liberate Trio suite in a secure, ready-to-use cloud environment, reducing setup time by 25X and enabling M31 to successfully speed up overall time to market by 5X.
As a global professional IP provider, M31 is determined to rapidly provide forward-looking silicon IPs for trending applications to meet diverse IC design needs. M31 has been using the trusted Cadence library characterization portfolio for many years, and the Liberate Trio suite provided optimal scalability, speed and reliability with this latest design project. To deliver its high-quality silicon IP, M31 required additional hardware compute resources to complement M31’s on-premises infrastructure, so adopting the CloudBurst platform was the next logical step. Moving design work to CloudBurst meant M31 didn’t need to make up-front capital expenditures or devote dedicated IT resources to setting up the equipment, saving both time and money. M31 benefitted from having the ability to address peak design requirements while reducing the delivery timeline, hardware costs and risks. Also, the Liberate Trio suite features Bolt technology, an integrated job distribution system, which provided M31 with reliable characterization in the cloud across 10,000 CPU cores in parallel.
“M31 has been committed to delivering differentiated silicon-proven IP to our customers on schedule, and our multi-year collaboration with Cadence ensures that we stay ahead of aggressive time-to-market demands,” said Scott Chang, CEO of M31. “By combining the Cadence CloudBurst platform with our existing production-proven and foundry-certified Liberate Trio environment, Cadence delivered a secure, cloud-based characterization solution that enabled M31 to quickly scale production to meet our time-to-market goals.”
Download The System Designer’s Guide to… System Analysisby Brad Griffin. You can also view other titles in our full I-007e Book library here.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
Electronic System Design Industry Posts $4.9 Billion in Revenue in Q4 2024
04/15/2025 | SEMIElectronic System Design (ESD) industry revenue increased 11% to $4,927.3 million in the fourth quarter of 2024 from the $4440.9 million reported in the fourth quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
04/17/2025 | Matt Stevenson -- Column: Connect the DotsIf you have read any of my earlier columns, you know I am passionate about helping designers design for the reality of manufacturing. Designing for manufacturability (DFM) is a team sport. DFM is a design process that looks forward to the manufacturing process and integrates with it so that manufacturing requirements and capabilities can be accurately reflected in the design work.
Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead
04/17/2025 | Jerome Larez -- Column: Global PCB ConnectionsHigh density interconnect (HDI) printed circuit boards have come a long way from their origins as a niche technology for miniaturized applications. Today, HDI PCBs are at the forefront of innovation, driven by an insatiable demand for faster, smaller, and more powerful electronic devices. As consumer electronics, 5G infrastructure, and AI-driven systems advance, design engineers must stay ahead of the curve to ensure their PCB designs meet evolving industry demands.