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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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TopLine Ships JEDEC Matrix IC Trays and Waffle Packs from Stock

07/30/2026 | TopLine
TopLine ships a complete range of JEDEC Matrix IC trays and Waffle Packs for a wide variety of components, from stock, eliminating long wait times for components, including BGA, QFN, QFP, PLCC, TSOP, and many others.

Trouble in Your Tank: At 40 GHz, Everything Matters, Part 2

07/27/2026 | Michael Carano -- Column: Trouble in Your Tank
In Part 1 of this article, we examined alternative solderable finishes for 5G/6G applications and reviewed literature on their performance at high frequencies. We found that certain solderable finishes are more susceptible to signal loss as frequency increases. These attenuation losses become increasingly significant at frequencies approaching and exceeding 40 GHz. Because of their high conductivity, silver and copper generally outperform finishes such as nickel and palladium. Taken together, these findings underscore the importance of finish selection in high-frequency applications.

It’s Only Common Sense: Stop Watching the Headlines and Start Watching the Opportunity

07/27/2026 | Dan Beaulieu -- Column: It's Only Common Sense
If you spend too much time watching the news, you could easily convince yourself that the electronics industry is headed for trouble. Every day seems to bring another story about tariffs, supply chain disruptions, labor shortages, geopolitical tensions, inflation, slowing economies, or uncertainty in global markets. It is enough to make even experienced business leaders question what comes next.

Henniker Plasma Targets Throughput and Process Stability with Stratus Manufacturing Solution

07/20/2026 | Henniker Plasma
Manufacturers scaling a bonding, coating or printing process to full production rarely struggle with the science of surface treatment; they struggle with holding it steady, line after line, shift after shift.

Ionic Contamination Debate Highlights Growing Divide in Automotive Electronics

07/15/2026 | I-Connect007 Editorial Team
A recent Global Electronics Association panel discussion revealed both broad agreement and sharp differences regarding one of electronics manufacturing’s most persistent reliability questions: How clean is clean enough? The discussion, focused on ionic contamination assessment in electronic control unit (ECU) manufacturing, brought together the following experts:  Tim Dietz from Ford Motor Company, Dr. Lothar Henneken from Robert Bosch, Eric Camden from Foresite, Hubertus Mertens from MKS’ Atotech, Doug Pauls from It Depends Electronics, and Stan Rak from SF Rak Company, as moderator. While everyone agreed that contamination control is essential for long-term reliability, panelists differed significantly on whether ion chromatography (IC) should play a larger role in production acceptance and process control.
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