-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
KLA Moves PCB Design-for-Manufacturability Analysis to the Cloud
April 7, 2022 | PRNewswireEstimated reading time: 1 minute

KLA Corporation announced the launch of Frontline Cloud Services, a software solution that accelerates design-for-manufacturability (DFM) analysis and time-to-market (TTM) for complex printed circuit boards (PCBs). Advanced technologies, such as 5G and miniLED, call for PCBs with increasingly complex designs that require time-consuming, compute-intensive validation for manufacturability. This new cloud-based SaaS offering – an industry first – addresses this challenge by moving DFM analysis to the cloud, which significantly reduces IT bottlenecks and the amount of time needed to run analyses.
An on-premises DFM analysis can often take hours or even days, causing considerable delays in the mass production of PCBs for the electronics industry. To accelerate this process, KLA is transitioning its proven computer-aided manufacturing (CAM) and engineering technologies to the cloud, where compute power is virtually infinite.
"As a leader in PCB CAM, engineering and Industry 4.0 solutions, our customers share with us the bottlenecks that slow down their PCB manufacturing process," said Eran Lazar, general manager, Frontline division, and vice president at KLA. "We decided to tackle the challenges of DFM analysis by taking advantage of the unlimited computational power of the cloud, while keeping the proven application intact. For PCB manufacturers eager to make the most of cloud-based efficiencies while maintaining exacting security protocols, we continually ensure that Frontline Cloud Services meets the highest security standards."
Anecdotally, customers running comparative tests on complex PCBs saw Frontline Cloud Services enable up to 90% faster DFM analysis speeds. For example, one customer producing high-density interconnect (HDI) PCBs saw analysis time significantly shorten from 75 hours to 30 minutes when running the same DFM analysis on premises versus with Frontline Cloud Services, respectively. Another customer producing PCBs for miniLED ran a similar test and analysis time was reduced from nine hours to 20 minutes.
For PCB manufacturers, Frontline Cloud Services can:
- Accelerate DFM analysis to meet growing productivity demands
- Save on IT costs with scalable compute resources and monitored usage reports
- Address emerging electronics trends like 5G and miniLED, and their increased design complexity
- Provide access to consistently reliable, available and up-to-date services and tools
- Ensure the highest cloud security standards in the industry with both factory- and job-level security
- Enable fast onboarding to the cloud-based system with no training or implementation required
Suggested Items
Hon Hai Product Chief Xiao Caiyou Elected as Member of the Board of Directors of the NAM
04/15/2025 | Hon Hai Technology GroupHon Hai Technology Group, the world’s largest technology manufacturing and service provider, announced that Jerry Hsiao, Chief Product Officer and General Manager of the U.S. Regional Headquarters, has been invited by the National Association of Manufacturers ( NAM ) to officially join the NAM Board of Directors to help promote the competitiveness of the U.S. manufacturing industry and related policy initiatives.
Explore TRI's Test and Inspection Innovations at ElectroneX
04/15/2025 | TRIGPC Electronics, TRI's industry partner, will participate in the ElectroneX Electronics Design & Assembly Expo 2025 at the Melbourne Convention & Exhibition Centre, Australia, on May 7–8, 2025.
Industry Voices Highlighted in the April 2025 Issue of PCB007 Magazine
04/15/2025 | I-Connect007 Editorial TeamWe take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue of PCB007 Magazine. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
IPC Welcomes Exemptions to Reciprocal Tariffs
04/14/2025 | IPCIPC shared the following statement today on tariff exclusions and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO:
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Capital Expo & Tech Forum
04/11/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Capital Expo & Tech Forum taking place on May 8 at George Mason University – Mason Square in Arlington, Virginia.