-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
KLA Moves PCB Design-for-Manufacturability Analysis to the Cloud
April 7, 2022 | PRNewswireEstimated reading time: 1 minute
KLA Corporation announced the launch of Frontline Cloud Services, a software solution that accelerates design-for-manufacturability (DFM) analysis and time-to-market (TTM) for complex printed circuit boards (PCBs). Advanced technologies, such as 5G and miniLED, call for PCBs with increasingly complex designs that require time-consuming, compute-intensive validation for manufacturability. This new cloud-based SaaS offering – an industry first – addresses this challenge by moving DFM analysis to the cloud, which significantly reduces IT bottlenecks and the amount of time needed to run analyses.
An on-premises DFM analysis can often take hours or even days, causing considerable delays in the mass production of PCBs for the electronics industry. To accelerate this process, KLA is transitioning its proven computer-aided manufacturing (CAM) and engineering technologies to the cloud, where compute power is virtually infinite.
"As a leader in PCB CAM, engineering and Industry 4.0 solutions, our customers share with us the bottlenecks that slow down their PCB manufacturing process," said Eran Lazar, general manager, Frontline division, and vice president at KLA. "We decided to tackle the challenges of DFM analysis by taking advantage of the unlimited computational power of the cloud, while keeping the proven application intact. For PCB manufacturers eager to make the most of cloud-based efficiencies while maintaining exacting security protocols, we continually ensure that Frontline Cloud Services meets the highest security standards."
Anecdotally, customers running comparative tests on complex PCBs saw Frontline Cloud Services enable up to 90% faster DFM analysis speeds. For example, one customer producing high-density interconnect (HDI) PCBs saw analysis time significantly shorten from 75 hours to 30 minutes when running the same DFM analysis on premises versus with Frontline Cloud Services, respectively. Another customer producing PCBs for miniLED ran a similar test and analysis time was reduced from nine hours to 20 minutes.
For PCB manufacturers, Frontline Cloud Services can:
- Accelerate DFM analysis to meet growing productivity demands
- Save on IT costs with scalable compute resources and monitored usage reports
- Address emerging electronics trends like 5G and miniLED, and their increased design complexity
- Provide access to consistently reliable, available and up-to-date services and tools
- Ensure the highest cloud security standards in the industry with both factory- and job-level security
- Enable fast onboarding to the cloud-based system with no training or implementation required
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
EPTAC Expands. New HQ in Salem, NH, Draws Industry Leaders
04/30/2026 | EPTAC CorporationEPTAC, a global leader in electronics manufacturing training, has opened its new corporate headquarters and training facility in Salem, New Hampshire, expanding its capacity to support workforce development across North America.
From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
04/30/2026 | I-Connect007I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.
Global Electronics Association and CalcuQuote, an Elisa Industriq Business, Launch Joint Supply Chain Intelligence Initiative
04/29/2026 | Global Electronics AssociationThe Global Electronics Association and CalcuQuote, Elisa Industriq today announced a partnership to deliver timely, actionable supply chain intelligence for the electronics industry.
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?