-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
KLA Moves PCB Design-for-Manufacturability Analysis to the Cloud
April 7, 2022 | PRNewswireEstimated reading time: 1 minute
KLA Corporation announced the launch of Frontline Cloud Services, a software solution that accelerates design-for-manufacturability (DFM) analysis and time-to-market (TTM) for complex printed circuit boards (PCBs). Advanced technologies, such as 5G and miniLED, call for PCBs with increasingly complex designs that require time-consuming, compute-intensive validation for manufacturability. This new cloud-based SaaS offering – an industry first – addresses this challenge by moving DFM analysis to the cloud, which significantly reduces IT bottlenecks and the amount of time needed to run analyses.
An on-premises DFM analysis can often take hours or even days, causing considerable delays in the mass production of PCBs for the electronics industry. To accelerate this process, KLA is transitioning its proven computer-aided manufacturing (CAM) and engineering technologies to the cloud, where compute power is virtually infinite.
"As a leader in PCB CAM, engineering and Industry 4.0 solutions, our customers share with us the bottlenecks that slow down their PCB manufacturing process," said Eran Lazar, general manager, Frontline division, and vice president at KLA. "We decided to tackle the challenges of DFM analysis by taking advantage of the unlimited computational power of the cloud, while keeping the proven application intact. For PCB manufacturers eager to make the most of cloud-based efficiencies while maintaining exacting security protocols, we continually ensure that Frontline Cloud Services meets the highest security standards."
Anecdotally, customers running comparative tests on complex PCBs saw Frontline Cloud Services enable up to 90% faster DFM analysis speeds. For example, one customer producing high-density interconnect (HDI) PCBs saw analysis time significantly shorten from 75 hours to 30 minutes when running the same DFM analysis on premises versus with Frontline Cloud Services, respectively. Another customer producing PCBs for miniLED ran a similar test and analysis time was reduced from nine hours to 20 minutes.
For PCB manufacturers, Frontline Cloud Services can:
- Accelerate DFM analysis to meet growing productivity demands
- Save on IT costs with scalable compute resources and monitored usage reports
- Address emerging electronics trends like 5G and miniLED, and their increased design complexity
- Provide access to consistently reliable, available and up-to-date services and tools
- Ensure the highest cloud security standards in the industry with both factory- and job-level security
- Enable fast onboarding to the cloud-based system with no training or implementation required
Suggested Items
Real Time with… IPC APEX EXPO 2024: Insulectro on Attracting Young Talent to the Electronics Manufacturing Industry
05/16/2024 | Real Time with...IPC APEX EXPOInsulectro's Doug Gotelli and Mitchell Benson explore the challenges of drawing young talent into the electronics manufacturing industry. They underscore the significance of manufacturing and the urgency of tackling the workforce shortage. They also discuss internship programs, the industry's resilience amid the pandemic, and the rewarding experiences of working in this sector.
European Chips Skills Academy Launches Summer School in Italy to Promote Microelectronics Industry Careers
05/16/2024 | SEMIUniversity students will connect with professors to explore semiconductor learning paths and employment opportunities at the European Chip Skills Academy Summer School, August 18-23, 2024 in Bologna, Italy.
SEMICON West 2024 to Spotlight U.S. Chip Industry Investments, Supply Chain Resilience, Talent, and Global Growth and Innovation
05/15/2024 | SEMISEMICON West 2024 will gather industry experts and leaders July 9-11 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues.
A Potpourri of Design PD Classes
05/14/2024 | Kelly Dack, I-Connect007What is invention without innovation? What is innovation without capability? Kelly Dack addresses these questions and more in this review of the Professional Development courses at IPC APEX EXPO, including the flex course lead by "Flexperts" Mark Finstad and Nick Koop.
Viscom’s Approach to Inline X-Ray
05/14/2024 | Barry Matties, I-Connect007In this interview, Viscom President Ed Moll and CEO Jesper Lykke discuss the importance of inline X-rays for real-time data and board inspection. They also discuss AI integration, customer inquiries, and ROI considerations. Also, as Ed moves into semi-retirement, he reflects on his long career, recent developments, and the evolving X-ray industry. He shares his insights on career opportunities for emerging engineers in the industry.