-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
IMI, BYU Hawaii Collaborate on First On-Campus Online Internship Program
April 20, 2022 | IMIEstimated reading time: 1 minute
Integrated Micro-Electronics Inc. (IMI), partnered with Brigham Young University (BYU) Hawaii for its first international online on-campus internship program that was completed last April. Spearheaded by the Learning and Development group of the company’s Human Resources department, a group of five students from BYU-H embarked on developing a Training Records Automation & Competency Development Program platform for IMI. The group designed a website application using PHP, MySQL, HTML, and CSS that can create, read, update, and delete training records of IMI employees. The company currently uses an Excel file to document all relevant data which may be prone to human error and inefficiencies. With the platform, IMI employees may be able to track their own training data at real-time from any location.
The online internship program allows the students to remain in their own country and university while completing assigned projects. The students and team from IMI met weekly to align and discuss the progress and culminated with a final presentation at the end of the project period. This pilot-program saved costs associated with on-site internships for both BYU-H students and IMI. The students learned at their own pace and experienced real-life exposure in addressing corporate challenges while IMI was the recipient of innovative ideas and the platform itself at no cost.
This project began in January of 2022 and ended after approximately three months with the group of students logging in a combined total of more than 550 hours for the project.
The team from IMI included Ronald Hilaria, Norman Paca, Isabel Ceballos, Gaylirose Adame, Stephanie Lloren, Ronald Regalado, Davees John Baclay and Sherwin Nones.
Suggested Items
SMTA Announces Wafer-Level Packaging Symposium Program
01/08/2025 | SMTAThe SMTA is excited to announce the technical program for the 2025 Wafer-Level Packaging Symposium. The symposium will be held February 18-20, 2025 at The Hyatt Regency San Francisco Airport in San Francisco, California.
Siemens Launches New Program to Empower Startups with Cutting-edge Technology
01/07/2025 | SiemensSiemens launched Siemens for Startups, a new program to empower early-stage engineering and manufacturing startups.
$100M Investment Will Propel Absolics, Georgia Tech’s Advanced Packaging Research
12/30/2024 | Georgia TechAs part of the CHIPS National Advanced Packaging Manufacturing Program (NAPMP), three advanced packaging research projects will receive investments of up to $100 million each.
'Qualcomm AI Program for Innovators' Launched to Foster On-Device AI Innovation in the Asia-Pacific Region
12/27/2024 | Qualcomm Technologies, Inc.Qualcomm Technologies, Inc. announced the launch of the Qualcomm AI Program for Innovators (QAIPI) 2025 - APAC, a new initiative aimed at supporting professional developers and startups from Japan, Singapore, and South Korea to create cutting-edge on-device AI solutions across diverse sectors.
Kitron Secures $5 Million Defense Contract for U.S. Army
12/19/2024 | KitronThe order is for custom electronics for the U.S. Army and allied forces. Production will take place at Kitron’s U.S. facility in Windber, PA, and deliveries are expected to start in mid-2025. Kitron is a leading Scandinavian electronics manufacturing services company forthe Connectivity, Electrification, Industry, Medical devices and Defence/Aerospace sectors. The group is located in Norway, Sweden, Denmark,Lithuania, Germany, Poland, the Czech Republic, India, Malaysia, China and the United States.