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SMTA Announces Wafer-Level Packaging Symposium Program

01/08/2025 | SMTA
The SMTA is excited to announce the technical program for the 2025 Wafer-Level Packaging Symposium. The symposium will be held February 18-20, 2025 at The Hyatt Regency San Francisco Airport in San Francisco, California.

Siemens Launches New Program to Empower Startups with Cutting-edge Technology

01/07/2025 | Siemens
Siemens launched Siemens for Startups, a new program to empower early-stage engineering and manufacturing startups.

$100M Investment Will Propel Absolics, Georgia Tech’s Advanced Packaging Research

12/30/2024 | Georgia Tech
As part of the CHIPS National Advanced Packaging Manufacturing Program (NAPMP), three advanced packaging research projects will receive investments of up to $100 million each.

'Qualcomm AI Program for Innovators' Launched to Foster On-Device AI Innovation in the Asia-Pacific Region

12/27/2024 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. announced the launch of the Qualcomm AI Program for Innovators (QAIPI) 2025 - APAC, a new initiative aimed at supporting professional developers and startups from Japan, Singapore, and South Korea to create cutting-edge on-device AI solutions across diverse sectors.

Kitron Secures $5 Million Defense Contract for U.S. Army

12/19/2024 | Kitron
The order is for custom electronics for the U.S. Army and allied forces. Production will take place at Kitron’s U.S. facility in Windber, PA, and deliveries are expected to start in mid-2025. Kitron is a leading Scandinavian electronics manufacturing services company forthe Connectivity, Electrification, Industry, Medical devices and Defence/Aerospace sectors. The group is located in Norway, Sweden, Denmark,Lithuania, Germany, Poland, the Czech Republic, India, Malaysia, China and the United States.
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