-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Amphenol Reports First Quarter 2022 Results
May 1, 2022 | Amphenol CorporationEstimated reading time: 2 minutes
Amphenol Corporation reported first quarter 2022 results.
“We are pleased to have closed the first quarter of 2022 with sales and Adjusted Diluted EPS exceeding the high end of our guidance,” said Amphenol President and Chief Executive Officer, R. Adam Norwitt. “Sales increased from prior year by a strong 24%, supported by robust growth across all of our end markets, as well as contributions from the Company’s acquisition program. Despite facing substantial inflationary pressures and supply chain disruptions, we realized strong profitability, with operating margins reaching 20.0% and Adjusted Diluted EPS growing by an impressive 29% from prior year. We are very proud of the Company’s outstanding performance in this most challenging and dynamic quarter.”
New Segment Reporting
As previously announced, beginning this quarter, the Company is reporting its financial results in three new segments: Harsh Environment Solutions (HES), Communications Solutions (CS) and Interconnect and Sensor Systems (ISS). The accompanying financial data reflects these new segments, as well as the recasting of relevant prior year period segment information in order to enable year-over-year segment comparisons.
Second Quarter 2022 Outlook
The current market environment remains highly uncertain, with continued supply chain and inflationary challenges as well as ongoing disruptions associated with the COVID-19 pandemic. Assuming conditions do not meaningfully worsen and assuming constant exchange rates, for the second quarter of 2022, Amphenol expects sales to be in the range of $2.890 billion to $2.950 billion, representing 9% to 11% growth over the second quarter of 2021. Adjusted Diluted EPS is expected to be in the range of $0.66 to $0.68, representing 8% to 11% growth over the second quarter of 2021.
“Despite the ongoing challenges and uncertainties around the world, we are very pleased with the Company’s strong First Quarter results,” Norwitt continued. “The revolution in electronics continues to accelerate, creating exciting and dynamic long-term growth opportunities for Amphenol across each of our diversified end markets. Our ongoing drive to leverage our competitive advantages and create sustained financial strength, as well as our initiatives to expand our product offerings, both organically and through our acquisition program, have created an excellent base for the Company’s future performance. I am confident in the ability of our outstanding entrepreneurial management team to continue to dynamically adjust to changing market conditions, to capitalize on the wide array of growth opportunities that arise in all market cycles and to continue to generate sustainable long-term value for our shareholders and other stakeholders. Most importantly, I remain truly grateful to our team for their extraordinary efforts in navigating the myriad of challenges around the world and continuing to strongly support our customers and drive outstanding operating performance.”
Suggested Items
Altair Solutions Now Supported on NVIDIA Grace Hopper and Grace CPU Superchip Architectures
11/22/2024 | AltairAltair, a global leader in computational intelligence, announced that several products from the Altair® HyperWorks® design and simulation platform now support NVIDIA Grace CPU and Grace Hopper Superchip architectures.
Keysight, Instrumentix Partner to Launch Complete Trade Monitoring Solution for Financial Markets
11/21/2024 | Keysight TechnologiesKeysight Technologies, Inc. expanded its financial capital markets portfolio through a partnership with Instrumentix to introduce a cutting-edge trade solution.
Infineon, Quantinuum Partner to Accelerate Quantum Computing Towards Meaningful Real-world Applications
11/20/2024 | InfineonInfineon Technologies AG, a global leader in semiconductor solutions, and Quantinuum, a global leader in integrated, full-stack quantum computing, today announced a strategic partnership to develop the future generation of ion traps.
Cadence Unveils Arm-Based System Chiplet
11/20/2024 | Cadence Design SystemsCadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.
ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production
11/20/2024 | ASMPTThe high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.