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Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe

04/15/2025 | Indium Corporation
Indium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.

Worldwide Smartphone Market Grew 1.5% in Q1 2025, Amid On-going US-China Trade Tension

04/15/2025 | IDC
According to preliminary data from the International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker , global smartphone shipments increased 1.5% year-over-year (YoY) to 304.9 million units in the first quarter of 2025 (1Q25).

Saki’s AXI Upgrade Enhances Image Noise Reduction for Power Modules, Enabling Sharper, More Accurate Inspections

04/11/2025 | Saki Corporation
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces significant enhancements to the image processing capabilities of its 3Xi-M200 X-ray Automated Inspection (AXI) system.

DuPont Ikonic 9000 CMP Pads Win 2025 Edison Award

04/09/2025 | DuPont
DuPont announced that its Ikonic™ 9000 series of polishing pads for chemical mechanical planarization (CMP) was awarded a 2025 Bronze Edison Award™ in the AI-driven advancements category.

DARPA Selects Cerebras to Deliver Next Generation, Real-Time Compute Platform for Advanced Military and Commercial Applications

04/08/2025 | Ranovus
Cerebras Systems, the pioneer in accelerating generative AI, has been awarded a new contract from the Defense Advanced Research Projects Agency (DARPA), for the development of a state-of-the-art high-performance computing system. The Cerebras system will combine the power of Cerebras’ wafer scale technology and Ranovus’ wafer scale co-packaged optics to deliver several orders of magnitude better compute performance at a fraction of the power draw.
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