Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
Summit Interconnect Acquires Royal Circuit Solutions and Affiliates
May 4, 2022 | Summit Interconnect, Inc.Estimated reading time: 2 minutes
Summit Interconnect is pleased to announce the acquisition of Royal Circuit Solutions with California operations in Hollister and Santa Ana and affiliate Advanced Assembly located in Aurora, Colorado. The acquisition expands Summit’s PCB offering in rigid, flex, rigid-flex and ATE PCBs, significantly strengthens engineering and service resources providing CAM, DFM/A, PCB design/layout, and also adds quick-turn, prototype SMT assembly services.
The combined company will provide best-in-industry use of software applications that integrate and automate engineering, stack ups, quoting, production management and customer interface. This highly developed platform will significantly improve speed and service to our valued customers.
Shane Whiteside, President and CEO of Summit Interconnect, Inc. stated, “This combination aligns the Royal and Advanced quick-turn, vertically integrated model with Summit’s differentiated production capabilities. Each entity brings capabilities to the Summit portfolio that will further strengthen our ability to serve our customers in both high-performance commercial and defense markets, as well as broaden our relationships into additional sectors. This is a very exciting milestone for Summit, Royal Circuits and Advanced Assembly and we welcome our new employees to the Summit team.”
Milan Shah, Owner and CEO of Royal Circuits commented, “We are very excited to align ourselves with the tremendous team at Summit and bring our automated software-powered approach to the Summit organization. Together, we will continue to build and scale a world-class company delivering technology solutions to solve the most complex printed circuit board challenges across all end markets.”
About Summit Interconnect: Summit Interconnect is a leading provider of complex printed circuit boards focused on fast growing defense and high-performance commercial sectors in the North American market. Summit offers solutions ranging from advanced cutting-edge prototyping to complex high mix, low-to-mid volume production. Summit’s facilities are located across California, Illinois, Colorado and Toronto, Canada. For more information, please visit: summit-pcb.com
About Royal Circuit Solutions: Established in 1998 and headquartered in Hollister, CA, Royal is one of North America’s leading providers of quick-turn, advanced technology prototype printed circuit boards. Royal provides customers across the industrial, medical, automotive, consumer, semiconductor, datacom and space markets with technology driven printed circuits in hours, not days. For more information, please visit: royalcircuits.com
About Advanced Assembly: For nearly twenty years, Advanced has helped engineers assemble PCBs in three days or less. Offering a full-range of manufacturing services for prototypes and low volume quantities. Advanced Assembly delivers at the speed of imagination. For more information, please visit: aapcb.com
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
On the Line With… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available
11/05/2025 | I-Connect007I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Materials, Up and Coming Capabilities,” host Nolan Johnson sits down with resident expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to discuss how material selection influences the Ultra HDI (UHDI) manufacturing process.
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
KYZEN Honored with 2025 Step-by-Step Excellence Award for Its Innovative ANALYST² Process Control System
10/31/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that its ANALYST² Process Control System has won a 2025 Step-by-Step Excellence Award (SbSEA).