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Atotech, Schweitzer Engineering Laboratories Announce Business Partnership
May 4, 2022 | AtotechEstimated reading time: 1 minute
Atotech, a leading specialty chemicals technology company and a market leader in advanced electroplating solutions, and Schweitzer Engineering Laboratories (SEL), an industry leader in the design and manufacture of digital products and systems that protect, control, and automate electric power systems, announced that they will partner at SEL’s state-of-the-art manufacturing facility under construction in Idaho, USA.
SEL will utilize Atotech’s innovative Uniplate equipment technology in their new 162,000 square-foot facility that will serve as home for SEL’s printed circuit board manufacturing operation. The Uniplate family of equipment is the industry standard for horizontal inline printed circuit board processes, from desmear and metallization to flash copper plating. The lines are scheduled to be commissioned in 2022.
John Hendrickson, Senior Engineering Manager at SEL, who will oversee SEL’s new operation, said: “As we start manufacturing our own printed circuit boards, we are committed to building the most modern, environmentally friendly, and safe PCB manufacturing facility in the United States. Atotech is a leader in their field and the right partner for us. Their horizontal plating technology offers an easy approach to automation with a focus on reducing chemical usage. This will help us meet our water recycling goals.”
Atotech’s significant investment into environmentally sound solutions benefits customers’ products and their production processes. These solutions reduce water, chemistry, energy, and waste generation, while reducing costs and meeting customer expectations for future PCB manufacturing.
“We are very excited to work with SEL to realize their needs in Idaho,” said Harald Ahnert, President of the Electronics segment at Atotech. “The equipment selected by SEL combines years of Atotech engineering leadership for horizontal production equipment. The Uniplate® family brings a highly automated and environmentally sound approach to PCB manufacturing.”
SEL previously announced that local in-house production of the PCB’s used in their digital products will provide the company with more freedom to experiment and innovate. It will also increase supply-chain security and yield superior product quality.
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04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
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04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
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The Chemical Connection: Surface Finishes for PCBs
03/31/2025 | Don Ball -- Column: The Chemical ConnectionWriting about surface finishes brings a feeling of nostalgia. You see, one of my first jobs in the industry was providing technical support for surface cleaning processes and finishes to enhance dry film adhesion to copper surfaces. I’d like to take this opportunity to revisit the basics, indulge in my nostalgia, and perhaps provide some insight into why we do things the way we do them in the here and now.