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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Atotech, Schweitzer Engineering Laboratories Announce Business Partnership
May 4, 2022 | AtotechEstimated reading time: 1 minute
Atotech, a leading specialty chemicals technology company and a market leader in advanced electroplating solutions, and Schweitzer Engineering Laboratories (SEL), an industry leader in the design and manufacture of digital products and systems that protect, control, and automate electric power systems, announced that they will partner at SEL’s state-of-the-art manufacturing facility under construction in Idaho, USA.
SEL will utilize Atotech’s innovative Uniplate equipment technology in their new 162,000 square-foot facility that will serve as home for SEL’s printed circuit board manufacturing operation. The Uniplate family of equipment is the industry standard for horizontal inline printed circuit board processes, from desmear and metallization to flash copper plating. The lines are scheduled to be commissioned in 2022.
John Hendrickson, Senior Engineering Manager at SEL, who will oversee SEL’s new operation, said: “As we start manufacturing our own printed circuit boards, we are committed to building the most modern, environmentally friendly, and safe PCB manufacturing facility in the United States. Atotech is a leader in their field and the right partner for us. Their horizontal plating technology offers an easy approach to automation with a focus on reducing chemical usage. This will help us meet our water recycling goals.”
Atotech’s significant investment into environmentally sound solutions benefits customers’ products and their production processes. These solutions reduce water, chemistry, energy, and waste generation, while reducing costs and meeting customer expectations for future PCB manufacturing.
“We are very excited to work with SEL to realize their needs in Idaho,” said Harald Ahnert, President of the Electronics segment at Atotech. “The equipment selected by SEL combines years of Atotech engineering leadership for horizontal production equipment. The Uniplate® family brings a highly automated and environmentally sound approach to PCB manufacturing.”
SEL previously announced that local in-house production of the PCB’s used in their digital products will provide the company with more freedom to experiment and innovate. It will also increase supply-chain security and yield superior product quality.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.