-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Atotech, Schweitzer Engineering Laboratories Announce Business Partnership
May 4, 2022 | AtotechEstimated reading time: 1 minute
Atotech, a leading specialty chemicals technology company and a market leader in advanced electroplating solutions, and Schweitzer Engineering Laboratories (SEL), an industry leader in the design and manufacture of digital products and systems that protect, control, and automate electric power systems, announced that they will partner at SEL’s state-of-the-art manufacturing facility under construction in Idaho, USA.
SEL will utilize Atotech’s innovative Uniplate equipment technology in their new 162,000 square-foot facility that will serve as home for SEL’s printed circuit board manufacturing operation. The Uniplate family of equipment is the industry standard for horizontal inline printed circuit board processes, from desmear and metallization to flash copper plating. The lines are scheduled to be commissioned in 2022.
John Hendrickson, Senior Engineering Manager at SEL, who will oversee SEL’s new operation, said: “As we start manufacturing our own printed circuit boards, we are committed to building the most modern, environmentally friendly, and safe PCB manufacturing facility in the United States. Atotech is a leader in their field and the right partner for us. Their horizontal plating technology offers an easy approach to automation with a focus on reducing chemical usage. This will help us meet our water recycling goals.”
Atotech’s significant investment into environmentally sound solutions benefits customers’ products and their production processes. These solutions reduce water, chemistry, energy, and waste generation, while reducing costs and meeting customer expectations for future PCB manufacturing.
“We are very excited to work with SEL to realize their needs in Idaho,” said Harald Ahnert, President of the Electronics segment at Atotech. “The equipment selected by SEL combines years of Atotech engineering leadership for horizontal production equipment. The Uniplate® family brings a highly automated and environmentally sound approach to PCB manufacturing.”
SEL previously announced that local in-house production of the PCB’s used in their digital products will provide the company with more freedom to experiment and innovate. It will also increase supply-chain security and yield superior product quality.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.