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BOOK EXCERPT: The Printed Circuit Designer’s Guide to... UV Curable Conformal Coatings

06/09/2026 | I-Connect007
Chapter 1: Options for Protecting Electronic Assemblies and a Deep Dive into UV Conformal Coatings. Electronics, depending on fit and function, have different protective options including conformal coatings, potting materials, encapsulants, protective enclosures, sealing and gaskets.

Trouble in Your Tank: The Role of Organic Solderability Preservatives in Advanced Packaging

06/08/2026 | Michael Carano -- Column: Trouble in Your Tank
Technology trends shaping the electronics industry supply chain—AI, IoT, ADAS, and high-performance computing (HPC)—are driving finer circuit features and higher layer counts. Advanced packaging drives the selection of surface finishes depending on the application. Typical designs require excellent solder joint reliability and wire bondability. It is not uncommon for designers to specify the organic solderability preservatives (OSP) on the BGA side of the substrate and precious-metal-plated finishes on the top side, which facilitate wire bonding.

Lockheed Martin Delivers First Integrated Combat System Baseline for the U.S. Navy

06/01/2026 | Lockheed Martin
Lockheed Martin has successfully delivered the first Integrated Combat System (ICS)-enabled baseline to the U.S. Navy.

Connect the Dots: What Designers Should Know About Non-conductive Via Fill

05/28/2026 | Matt Stevenson -- Column: Connect the Dots
The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly called upon to produce ultra high density interconnect (UHDI) PCBs, so it’s important to tune our production capabilities and customer service models to this trend. Non-conductive via fill (NCVF) offers a cost-effective, reliable manufacturing method that accommodates the densely packed, fine-pitch ball grid array (BGA) components present in UHDI designs.

Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components

05/13/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces. 
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