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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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HDP User Group Announces LiloTree Membership
May 5, 2022 | HDP User GroupEstimated reading time: Less than a minute
High Density Packaging (HDP) User Group is pleased to announce that LiloTree has become a member.
“LiloTree is excited to be a member of the HDP User Group. We look forward to engaging and learning from member partners through the collaborating efforts approach fosterd by the HDP team. LiloTree has invented several novel surface finish solutions for optimum performance and better reliability including a technology for high frequency PCBs applications. By contributing our knowledge in surface finishes, we believe that our participation will assist in the projects related to printed circuit boards raw-materials, reliability and signal integrity,” said Dr. Kunal Shah, President at LiloTree.
“I am pleased to welcome LiloTree to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in surface finishes for printed circuit boards will contribute significantly to several of our projects, especially those focused on high-frequency applications”, said Larry Marcanti, Executive Director of HDP User Group.
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Rachael Temple - AlltematedSuggested Items
Elsyca Acquires Hivelix to Strengthen Simulation Platform for Electrochemical Surface Engineering
04/03/2026 | ElsycaElsyca, a global pioneer in computer-aided engineering (CAE) simulation for electrochemical processes and surface finishing, announces the acquisition of Hivelix, a specialist in advanced surface treatment simulation with strong expertise in multiphysics modelling and AI-assisted process optimisation.
Connect the Dots: Designing for the Future of Manufacturing Reality—Solder Mask and Legend
04/09/2026 | Matt Stevenson -- Column: Connect the DotsPCBs seem to be getting more complex by the day, so it is important for designers to keep educating themselves about the realities of manufacturing increasingly intricate boards. Last month’s column highlighted design considerations for the strip-etch-strip process and how manufacturers approach that phase of production. Now that we have a functioning board, we must protect the PCB from environmental hazards and document the circuit components. This article will detail the solder mask and legend process and offer best practices for designers to ensure a high-quality result.
Take the Mic: Photo Chemical Systems: 50 Years Strong
04/03/2026 | Real Time with... APEX EXPOPhoto Chemical Systems is celebrating 50 years in the bare board PCB market. David Graves and Jason Averette discuss how they've expanded into assembly, leveraging strong relationships and a customer-centric approach to navigate supply chain challenges. With innovative solutions and future growth strategies, including AI integration and new market ventures, Photo Chemical Systems continues enduring success.
Bold Laser Automation Introduces Precision Laser Cleaning System for Advanced Manufacturing
03/27/2026 | PRNewswireBold Laser Automation, Inc. has introduced the LPCl1820UV Laser Precision Cleaning System, a Class 1, industrial laser platform engineered for high-precision surface cleaning and thin-film removal in demanding manufacturing environments.
The Chemical Connection: Managing Cumulative Process Variations for Fun and Profit
03/23/2026 | Don Ball -- Column: The Chemical ConnectionTolerances have become increasingly tight as PCBs have grown more complex and reduced in size, weight, and power consumption. Even if we maintain a traditional ±10% variation in etched line width, the tolerance in a 50 µm (0.002" or 2 mils) wide etched line is only 5 µm (0.0002” or 0.2 mils). That’s not very much, and it gets even worse as the line and space requirements drop to 25 µm lines and spaces.