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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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HDP User Group Announces LiloTree Membership
May 5, 2022 | HDP User GroupEstimated reading time: Less than a minute
High Density Packaging (HDP) User Group is pleased to announce that LiloTree has become a member.
“LiloTree is excited to be a member of the HDP User Group. We look forward to engaging and learning from member partners through the collaborating efforts approach fosterd by the HDP team. LiloTree has invented several novel surface finish solutions for optimum performance and better reliability including a technology for high frequency PCBs applications. By contributing our knowledge in surface finishes, we believe that our participation will assist in the projects related to printed circuit boards raw-materials, reliability and signal integrity,” said Dr. Kunal Shah, President at LiloTree.
“I am pleased to welcome LiloTree to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in surface finishes for printed circuit boards will contribute significantly to several of our projects, especially those focused on high-frequency applications”, said Larry Marcanti, Executive Director of HDP User Group.
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04/10/2025 | SMTAThe SMTA is pleased to announce the Best Papers from SMTA International 2024. The winners were selected by members of the conference technical committee. Awards are given for "Best of Proceedings" as well as "Best Practical and Applications-Based Knowledge" categories. A plaque is given to primary authors of all winning papers for these exceptional achievements.
Thales & Saildrone Integrate Blue Sentry Array with Uncrewed Systems
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Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
Airbus to Design and Build ESA’s ExoMars Rover Lander Platform
03/31/2025 | AirbusAirbus has been selected by the European Space Agency (ESA) and Thales Alenia Space (TAS - a joint venture between Thales (67%) and Leonardo (33%)), the ExoMars industrial prime contractor, to build key systems for the ExoMars lander that will safely place the Rosalind Franklin rover on the surface of the Red Planet.
The Chemical Connection: Surface Finishes for PCBs
03/31/2025 | Don Ball -- Column: The Chemical ConnectionWriting about surface finishes brings a feeling of nostalgia. You see, one of my first jobs in the industry was providing technical support for surface cleaning processes and finishes to enhance dry film adhesion to copper surfaces. I’d like to take this opportunity to revisit the basics, indulge in my nostalgia, and perhaps provide some insight into why we do things the way we do them in the here and now.