It’s Only Common Sense: 20 Lessons in 20 Years—A Career in Common Sense
The Marketing Minute: Staying Positive When the Market Isn’t
Marcy’s Musings: Continuing to Invent the Future With SEL
HDP User Group Announces LiloTree Membership
May 5, 2022 | HDP User GroupEstimated reading time: Less than a minute
High Density Packaging (HDP) User Group is pleased to announce that LiloTree has become a member.
“LiloTree is excited to be a member of the HDP User Group. We look forward to engaging and learning from member partners through the collaborating efforts approach fosterd by the HDP team. LiloTree has invented several novel surface finish solutions for optimum performance and better reliability including a technology for high frequency PCBs applications. By contributing our knowledge in surface finishes, we believe that our participation will assist in the projects related to printed circuit boards raw-materials, reliability and signal integrity,” said Dr. Kunal Shah, President at LiloTree.
“I am pleased to welcome LiloTree to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in surface finishes for printed circuit boards will contribute significantly to several of our projects, especially those focused on high-frequency applications”, said Larry Marcanti, Executive Director of HDP User Group.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Polar Instruments Announces Additive Transmission Line Support for Si9000e
08/20/2025 | Polar InstrumentsTransmission lines embedded into the PCB surface are a feature of UHDI constructions. The 2025 fall release of Polar's Si9000e PCB impedance & insertion loss transmission line field solver incorporates eight new single ended, differential and coplanar transmission line structures.
Henniker Plasma Launches Stratus Turnkey Plasma Manufacturing Cell
08/13/2025 | Henniker PlasmaHenniker Plasma, a leading manufacturer of plasma treatment systems, proudly announces the launch of its Stratus Plasma Manufacturing Cell range — a fully integrated, turnkey solution that combines advanced atmospheric plasma surface treatment with robotic automation.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.