Flexiramics Reaches Breakthrough in Thermal Conductivity

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Flexiramics B.V. is pleased to announce that their Flexiramics-E thin film products have reached a bulk thermal conductivity of 1.8 W/mK in the Z-direction. This breakthrough result makes the thermal conductivity of Flexiramics-E thin film twice as high as any other thin film available on the market today.

Flexiramics-E prevents sub-optimal performance of electronic components

Integration and microelectronic packaging technology are causing the power density of electronic components to increase, while their dimensions and those of electronic devices are getting smaller and miniaturized. This causes the generated heat to rapidly accumulate, thus resulting in sub-optimal performance of electronic components. Therefore, the heat dissipation of electronic components has evolved into a major focus of current electronic components and electronic device manufacturing.

Thermal conductivity compared

The thermal conductivity of the circuit boards is particularly low for flexible substrates, and this remains a critical bottleneck regarding improved heat dissipation. Especially in the out of plane (Z) direction. Most commercially available materials have a Tc between 0.2 and 0.8 W/mK in the Z-direction. Flexiramics-E thin polymer films have achieved 1.8 W/mK in the Z-direction. And future generations can achieve even higher values. As additional benefits, Flexiramics-E thin polymer films exhibit significantly increased dimensional stability in thermal cycling thanks to lower CTE vs. pure polymer.