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Keysight, Instrumentix Partner to Launch Complete Trade Monitoring Solution for Financial Markets

11/21/2024 | Keysight Technologies
Keysight Technologies, Inc. expanded its financial capital markets portfolio through a partnership with Instrumentix to introduce a cutting-edge trade solution.

Infineon, Quantinuum Partner to Accelerate Quantum Computing Towards Meaningful Real-world Applications

11/20/2024 | Infineon
Infineon Technologies AG, a global leader in semiconductor solutions, and Quantinuum, a global leader in integrated, full-stack quantum computing, today announced a strategic partnership to develop the future generation of ion traps.

Cadence Unveils Arm-Based System Chiplet

11/20/2024 | Cadence Design Systems
Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.

ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production

11/20/2024 | ASMPT
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.

L3Harris Delivers Optical System to NASA for Nancy Grace Roman Space Telescope

11/19/2024 | L3Harris Technologies
L3Harris Technologies has delivered the Optical Telescope Assembly (OTA) to NASA that serves as the critical “eye” for the Nancy Grace Roman Space Telescope by providing precise and stable imagery.
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