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In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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IPC Training Course on PCB Design for Printed and Wearable Devices
May 27, 2022 | IPCEstimated reading time: 1 minute

IPC will be holding a training course on PCB design for printed and wearable devices. The course will be held every Mondays and Wednesdays, 6:30 p.m. to 8:30 p.m., starting from June 6 to July 18, 2022.
This course aims to provide the skills necessary to create designs for printed electronics and wearable technologies in accordance with IPC standards. Taught by an IPC-certified industry expert with more than 25 years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and projects to facilitate mastery of the key concepts required by circuit board designers.
The program is designed to provide circuit board designers with a balanced foundation of theoretical knowledge and practical skills in printed circuit board design. Upon completion, participants will be able to design boards for printed electronics and wearables; understand the trade-offs in materials used in these applications; define a board stack-up with structures that meet the needs of these designs and mitigate signal integrity issues for these designs.
Attendees will also be able to define the effects of mechanical retention needs for these applications; implement component footprint and packaging methodologies; mitigate thermal effects; and employ the documentation requirements for these designs.
For more information visit IPC’s website.
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