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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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IPC Training Course on PCB Design for Printed and Wearable Devices
May 27, 2022 | IPCEstimated reading time: 1 minute

IPC will be holding a training course on PCB design for printed and wearable devices. The course will be held every Mondays and Wednesdays, 6:30 p.m. to 8:30 p.m., starting from June 6 to July 18, 2022.
This course aims to provide the skills necessary to create designs for printed electronics and wearable technologies in accordance with IPC standards. Taught by an IPC-certified industry expert with more than 25 years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and projects to facilitate mastery of the key concepts required by circuit board designers.
The program is designed to provide circuit board designers with a balanced foundation of theoretical knowledge and practical skills in printed circuit board design. Upon completion, participants will be able to design boards for printed electronics and wearables; understand the trade-offs in materials used in these applications; define a board stack-up with structures that meet the needs of these designs and mitigate signal integrity issues for these designs.
Attendees will also be able to define the effects of mechanical retention needs for these applications; implement component footprint and packaging methodologies; mitigate thermal effects; and employ the documentation requirements for these designs.
For more information visit IPC’s website.
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