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The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
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IPC Training Course on PCB Design for Printed and Wearable Devices
May 27, 2022 | IPCEstimated reading time: 1 minute
IPC will be holding a training course on PCB design for printed and wearable devices. The course will be held every Mondays and Wednesdays, 6:30 p.m. to 8:30 p.m., starting from June 6 to July 18, 2022.
This course aims to provide the skills necessary to create designs for printed electronics and wearable technologies in accordance with IPC standards. Taught by an IPC-certified industry expert with more than 25 years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and projects to facilitate mastery of the key concepts required by circuit board designers.
The program is designed to provide circuit board designers with a balanced foundation of theoretical knowledge and practical skills in printed circuit board design. Upon completion, participants will be able to design boards for printed electronics and wearables; understand the trade-offs in materials used in these applications; define a board stack-up with structures that meet the needs of these designs and mitigate signal integrity issues for these designs.
Attendees will also be able to define the effects of mechanical retention needs for these applications; implement component footprint and packaging methodologies; mitigate thermal effects; and employ the documentation requirements for these designs.
For more information visit IPC’s website.
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