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Advanced Electronics Packaging Digest

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GÖPEL electronic Introduces New Multi Line AXI 3D-CT X-Ray Inspection System

09/03/2026 | GÖPEL electronic
For years, GÖPEL electronic has been a leader in the field of inspection and non-destructive, comprehensive assembly testing at all levels.

Scanfil: MB Elettronica’s Plant 6 Boosts Integration and Testing Capabilities

09/01/2026 | Scanfil
MB Elettronica’s Plant 6 in Cortona, Italy, has been supporting the company’s operations since the opening earlier this year. 

Radbon Electronics Achieves IPC/WHMA-A-620 QML Validation, Joins IPC Global Qualified Manufacturers List

08/31/2026 | Global Electronics Association
Radbon Electronics Co., Ltd. (Radbon Electronics) has passed the IPC/WHMA-A-620 Qualified Manufacturers List (QML) validation by the Global Electronics Association, earning its place on the IPC Global Qualified Manufacturers List.

Semi-Kinetics Achieves ISO 9001, AS9100 and ISO 13485 Certifications at New Idaho Facility

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Semi-Kinetics, a leading provider of electronic manufacturing services, is proud to announce that it has achieved ISO 9001, AS9100 and ISO 13485 certification for its newly established manufacturing facility in Nampa, Idaho.

I-Connect007 Welcomes Newest Columnist, Tianming Liu, FSQuality

08/27/2026 | I-Connect007
I-Connect007 is excited to announce its newest columnist, Tianming Liu, founder of First Quality Circuit Co. Ltd. (FSQuality) and Fuji PCB. His new column, Bridging the Pacific, will draw on more than three decades of experience in PCB manufacturing to explore the different manufacturing cultures, practices, and perspectives found across the global electronics industry.
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