-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Altus Assists Cogent Technology with PCB Traceability
June 6, 2022 | Altus GroupEstimated reading time: 2 minutes
Traceability of PCBs is extremely important to improve production processes, however, it is becoming increasing difficult as technology advances and boards become smaller in size and more complex to manufacture. To ensure all PCBs are manufactured to the highest standards, Cogent Technology, a leading manufacturer of cutting-edge medical devices and instrumentation, consulted with capital equipment distributor, Altus Group to assist them with machines to handle the traceability of their multifaceted boards.
With one of the largest smart factories in Europe, manufacturing for international distribution, Cogent Technology ensures all devices are produced to the highest quality standards and continually enhance their capital equipment investment to guarantee production runs effectively.
Paul Harrison-Rowe, Cogent Technology Engineering Manager said: “For a medical device manufacturer such as Cogent Technology, traceability of sub-assemblies is vitally important to both the Client and the internal Cogent QMS processes.
“At the moment, serial number labels are printed and fitted by hand. This was suitable for a low volume batch build process; however, this is now hindered by an ever-increasing demand for volume products, and an ever-decreasing size of printed circuit board and associated available space for labels.”
Altus was able to offer a solution to the challenge with the YJ Link YLM Laser Marker. “As the production of highly advanced electronic assemblies increases, the importance of traceability has never been more important,” said Joe Booth, Altus CEO.
“High-tech manufacturers like Cogent Technology are looking for ways to implement processes to improve manufacture. But they must also integrate seamlessly into a ‘lights-out’ production plan. Aligning with these processes is the YLM Series Laser Marking solution.”
“As one of the most affordable and technologically advanced laser markers available in the marketplace today, the YLM Series Laser Marking ensures manufacturers meet high production targets with ease.”
Paul added: “The YLM Laser Marking machine can internally flip over the PCBs and mark the same serial number to both sides, as well as speeding up the application time and reducing cost. Also, since the Laser Marker effectively reduces the size of the serial number real estate, it could now be applied on PCBs where previously it was not possible.
“The Laser Marker will allow some other new features to be introduced, such as marking the work order number onto the waste material of the PCB panel or having the ability to be able to mark logos, dates etc. as required.”
Cogent Technology made further capital equipment investments with the selection of an Optilia BGA Inspection System. With parts no longer available for their existing machine, the Optilia platform included many features that would fit in with the company’s demanding requirements, including a larger Field-of-View to see beneath low stand-off BGAs.
Suggested Items
Intel Appoints Lip-Bu Tan as Chief Executive Officer
03/13/2025 | Intel CorporationIntel Corporation announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18.
TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity
03/13/2025 | TSMCMediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
Hon Hai Research Institute Launches Traditional Chinese LLM With Reasoning Capabilities
03/13/2025 | PRNewswireHon Hai Research Institute announced today the launch of the first Traditional Chinese Large Language Model (LLM), setting another milestone in the development of Taiwan's AI technology with a more efficient and lower-cost model training method completed in just four weeks.
indie Semiconductor and GlobalFoundries Announce Strategic Collaboration to Accelerate Automotive Radar Adoption
03/12/2025 | GlobalFoundriesindie Semiconductor, an automotive solutions innovator, has announced a strategic collaboration with GlobalFoundries (Nasdaq: GFS) (GF) to develop its portfolio of high-performance radar systems-on-chip (SoC).
atg Luther Maelzer to Showcase Latest Generation Large Format Flying Probe Test Systems at IPC APEX EXPO 2025
03/11/2025 | atg Luther & Maelzeratg Luther Maelzer will showcase their latest technology, the A9L, at the upcoming IPC APEX EXPO. The A9L will be on display from March 18 – 20 at the Anaheim Convention Center in Booth 3934.