Ynvisible Strengthens European Sales Channels, Signs Distribution Agreement With Computer Controls AG
June 16, 2022 | Ynvisible Interactive Inc.Estimated reading time: 1 minute
Ynvisible Interactive Inc., a fast-growing printed e-paper display manufacturer, positioning its technology as the lowest energy-consuming printed e-paper display on the market, has signed a distribution agreement with Switzerland-headquartered Computer Controls AG to distribute Ynvisible’s products and solutions for battery-driven or battery-less IoT devices. Computer Controls AG is a supplier of high-quality electronic components, IoT communication modules and technology for test & measurement.
The distribution partnership with Computer Controls AG expands Ynvisible’s sales footprint in the DACH (Germany, Austria, Switzerland) and East European markets. Computer Controls AG is a leading-edge technology supply partner to customers seeking high-level electronic solutions for IoT, electronic and mechanical engineering, ICT, and research & education.
“In line with our Q1 launch of Ynvisible’s printed e-paper display product, we are actively expanding our channels to market and are excited to strengthen our distributor network through this partnership with Computer Controls AG,” states Keith Morton, VP of Sales & Marketing at Ynvisible. “Computer Controls is a full range technical supplier to companies looking for leading-edge innovations to fuel new product creation. Their clients now gain access to Ynvisible’s printed e-paper displays that offer energy-efficient, ultra-low-power, thin, flexible displays, and provide endlessly customizable design freedom.”
“We are pleased that Ynvisible’s cutting-edge technology fits perfectly into our portfolio for IoT applications. We are determined to bring e-paper solutions quickly and competitively to the DACH and Eastern European markets”, says Harald Weigelt, Chairman of the Board of Directors of Computer Controls AG.
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).