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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

When Does Reducing Silver Make Sense?

10/27/2026 | Senthil Kanagavel, MacDermid Alpha Electronics Solutions
There is a single decision at the center of every die-attach conversation right now that isn’t as much about chemistry as it is about control. This is most evident because silver prices have experienced significant volatility, evolving PFAS requirements are increasing regulatory and customer scrutiny, qualification windows are shrinking, and the packages that support AI, automotive, and power infrastructure must meet demanding performance and reliability requirements.

Ventec Opens First Southeast Asia Manufacturing Facility in Thailand

10/26/2026 | Ventec
Ventec International Group announced the grand opening of its new manufacturing facility in Thailand, marking its first production base in Southeast Asia and an exciting new chapter in its global growth.

Trouble in Your Tank: Are PCB Fabricators Ready for the Next Technology Curve?

10/26/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry’s demand for smaller, faster, and more powerful devices is driving major advances in PCB manufacturing. One of the central priorities is to increase circuit density while maintaining performance and reliability. Manufacturers produce finer lines and spaces so more components can fit on smaller, more sophisticated boards. They are also refining SMT features to support tighter pitches without compromising performance.

SEHO Introduces SelectLine-S: German Engineering for the Asian Electronics Market

10/22/2026 | SEHO Systems GmbH
SEHO Systems GmbH will introduce the SelectLine-S, a new selective soldering machine, at NEPCON Shenzhen 2026, taking place October 27–29 in Shenzhen, China.

Qnity Advances Interconnect Innovations for Next-Generation Smart Consumer Electronics

10/22/2026 | Qnity
Qnity Electronics, Inc. introduces ultra-thin flex circuit materials that help enable the next generation of smart consumer electronics, including smartphones, AI glasses, and AR/VR devices, through advanced materials innovations that deliver exceptional bendability, mechanical performance, and reliability for advanced interconnect applications.
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